Wettability of CNT-doped solder under isothermal aging

Norliza Ismail, Roslina Ismail, Nur Izni Abd Aziz, Azman Jalar @ Jalil

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Wettability for lead free solder 99.0Sn-0.3Ag-0.7Cu (SAC237) with addition of different weight percentage carbon nanotube after thermal treatment was investigated. SAC 237 solder powder with flux was mixed with 0.01%, 0.02%, 0.03% and 0.04% carbon nanotubes (CNTs) to form SAC-CNTs solder paste. Printed solder paste on test board with Cu surface finish was then reflow under 270°C temperature and isothermal aging at 150°C for 0, 200 and 400 hours. Wettability of SAC-CNT solder was determined by measuring contact angle using optical microscope and image analyzer. As a result, from reflow process right through 400 hours of thermal aging, SAC237 with 0.04% CNT has the lowest contact angle as compared to other SAC-CNTs and SAC237 solder. As a conclusion, addition of carbon nanotubes into solder SAC237 improved their wettability on Cu substrate, especially at 0.04% of CNTs.

Original languageEnglish
Title of host publicationMaterials Science Forum
PublisherTrans Tech Publications Ltd
Pages76-78
Number of pages3
Volume857
ISBN (Print)9783035710205
DOIs
Publication statusPublished - 2016
EventInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China
Duration: 4 Dec 20155 Dec 2015

Publication series

NameMaterials Science Forum
Volume857
ISSN (Print)02555476

Other

OtherInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015
CountryTaiwan, Province of China
CityKaohsiung
Period4/12/155/12/15

Fingerprint

Carbon Nanotubes
solders
wettability
Soldering alloys
Wetting
Carbon nanotubes
Aging of materials
carbon nanotubes
Ointments
Contact angle
Thermal aging
optical microscopes
Powders
analyzers
Microscopes
Heat treatment
Fluxes
Substrates

Keywords

  • Carbon nanotube
  • Isothermal aging
  • Sn-Ag-Cu
  • Wettability

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Ismail, N., Ismail, R., Abd Aziz, N. I., & Jalar @ Jalil, A. (2016). Wettability of CNT-doped solder under isothermal aging. In Materials Science Forum (Vol. 857, pp. 76-78). (Materials Science Forum; Vol. 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.76

Wettability of CNT-doped solder under isothermal aging. / Ismail, Norliza; Ismail, Roslina; Abd Aziz, Nur Izni; Jalar @ Jalil, Azman.

Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. p. 76-78 (Materials Science Forum; Vol. 857).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ismail, N, Ismail, R, Abd Aziz, NI & Jalar @ Jalil, A 2016, Wettability of CNT-doped solder under isothermal aging. in Materials Science Forum. vol. 857, Materials Science Forum, vol. 857, Trans Tech Publications Ltd, pp. 76-78, International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, Province of China, 4/12/15. https://doi.org/10.4028/www.scientific.net/MSF.857.76
Ismail N, Ismail R, Abd Aziz NI, Jalar @ Jalil A. Wettability of CNT-doped solder under isothermal aging. In Materials Science Forum. Vol. 857. Trans Tech Publications Ltd. 2016. p. 76-78. (Materials Science Forum). https://doi.org/10.4028/www.scientific.net/MSF.857.76
Ismail, Norliza ; Ismail, Roslina ; Abd Aziz, Nur Izni ; Jalar @ Jalil, Azman. / Wettability of CNT-doped solder under isothermal aging. Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. pp. 76-78 (Materials Science Forum).
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abstract = "Wettability for lead free solder 99.0Sn-0.3Ag-0.7Cu (SAC237) with addition of different weight percentage carbon nanotube after thermal treatment was investigated. SAC 237 solder powder with flux was mixed with 0.01{\%}, 0.02{\%}, 0.03{\%} and 0.04{\%} carbon nanotubes (CNTs) to form SAC-CNTs solder paste. Printed solder paste on test board with Cu surface finish was then reflow under 270°C temperature and isothermal aging at 150°C for 0, 200 and 400 hours. Wettability of SAC-CNT solder was determined by measuring contact angle using optical microscope and image analyzer. As a result, from reflow process right through 400 hours of thermal aging, SAC237 with 0.04{\%} CNT has the lowest contact angle as compared to other SAC-CNTs and SAC237 solder. As a conclusion, addition of carbon nanotubes into solder SAC237 improved their wettability on Cu substrate, especially at 0.04{\%} of CNTs.",
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N2 - Wettability for lead free solder 99.0Sn-0.3Ag-0.7Cu (SAC237) with addition of different weight percentage carbon nanotube after thermal treatment was investigated. SAC 237 solder powder with flux was mixed with 0.01%, 0.02%, 0.03% and 0.04% carbon nanotubes (CNTs) to form SAC-CNTs solder paste. Printed solder paste on test board with Cu surface finish was then reflow under 270°C temperature and isothermal aging at 150°C for 0, 200 and 400 hours. Wettability of SAC-CNT solder was determined by measuring contact angle using optical microscope and image analyzer. As a result, from reflow process right through 400 hours of thermal aging, SAC237 with 0.04% CNT has the lowest contact angle as compared to other SAC-CNTs and SAC237 solder. As a conclusion, addition of carbon nanotubes into solder SAC237 improved their wettability on Cu substrate, especially at 0.04% of CNTs.

AB - Wettability for lead free solder 99.0Sn-0.3Ag-0.7Cu (SAC237) with addition of different weight percentage carbon nanotube after thermal treatment was investigated. SAC 237 solder powder with flux was mixed with 0.01%, 0.02%, 0.03% and 0.04% carbon nanotubes (CNTs) to form SAC-CNTs solder paste. Printed solder paste on test board with Cu surface finish was then reflow under 270°C temperature and isothermal aging at 150°C for 0, 200 and 400 hours. Wettability of SAC-CNT solder was determined by measuring contact angle using optical microscope and image analyzer. As a result, from reflow process right through 400 hours of thermal aging, SAC237 with 0.04% CNT has the lowest contact angle as compared to other SAC-CNTs and SAC237 solder. As a conclusion, addition of carbon nanotubes into solder SAC237 improved their wettability on Cu substrate, especially at 0.04% of CNTs.

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