Warpage and wire sweep analysis of QFN molded strip using experimental and modeling methods

Izhan Abdullah, Ng Cheong Chiang, Umizaimah Mokhtar, Asmawatie Said, Meor Zainal Meor Talib, Ibrahim Ahmad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Quad Flat No-lead (QFN) package is manufactured in a molded array format that maximizes product throughput. However, the excessive warpage and stress induced by thermal mismatch among different materials may affect the assembly processes due to the large matrix of the molded strip. In this study, both experimental and modeling works are resorted to analyze the warpage and wire sweep of QFN molded strip. Effect of QFN package size is investigated so as to provide the relation between warpage and metal to mold compound ratio. Design guideline for optimum metal to mold compound ratio can be obtained. Nonlinear large deformation finite element analysis has been performed to investigate the impact of die size and mold compound material properties on the warpage and stress induced. Thermal loading is applied to simulate the cooling process after molding. For wire sweep analysis, a design of experiment is performed by using three factors, i.e. transfer time, transfer force, and two types of mold compound. The results show that the new mold compound induced lower die stress but slightly higher wire sweep than current material.

Original languageEnglish
Title of host publicationProceedings of the Electronic Packaging Technology Conference, EPTC
Pages494-498
Number of pages5
DOIs
Publication statusPublished - 2007
Event9th Electronics Packaging Technology Conference, EPTC 2007 -
Duration: 12 Dec 200712 Dec 2007

Other

Other9th Electronics Packaging Technology Conference, EPTC 2007
Period12/12/0712/12/07

Fingerprint

Lead
Wire
Metals
Molding
Design of experiments
Materials properties
Throughput
Cooling
Finite element method
Hot Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Abdullah, I., Chiang, N. C., Mokhtar, U., Said, A., Meor Talib, M. Z., & Ahmad, I. (2007). Warpage and wire sweep analysis of QFN molded strip using experimental and modeling methods. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 494-498). [4469692] https://doi.org/10.1109/EPTC.2007.4469692

Warpage and wire sweep analysis of QFN molded strip using experimental and modeling methods. / Abdullah, Izhan; Chiang, Ng Cheong; Mokhtar, Umizaimah; Said, Asmawatie; Meor Talib, Meor Zainal; Ahmad, Ibrahim.

Proceedings of the Electronic Packaging Technology Conference, EPTC. 2007. p. 494-498 4469692.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abdullah, I, Chiang, NC, Mokhtar, U, Said, A, Meor Talib, MZ & Ahmad, I 2007, Warpage and wire sweep analysis of QFN molded strip using experimental and modeling methods. in Proceedings of the Electronic Packaging Technology Conference, EPTC., 4469692, pp. 494-498, 9th Electronics Packaging Technology Conference, EPTC 2007, 12/12/07. https://doi.org/10.1109/EPTC.2007.4469692
Abdullah I, Chiang NC, Mokhtar U, Said A, Meor Talib MZ, Ahmad I. Warpage and wire sweep analysis of QFN molded strip using experimental and modeling methods. In Proceedings of the Electronic Packaging Technology Conference, EPTC. 2007. p. 494-498. 4469692 https://doi.org/10.1109/EPTC.2007.4469692
Abdullah, Izhan ; Chiang, Ng Cheong ; Mokhtar, Umizaimah ; Said, Asmawatie ; Meor Talib, Meor Zainal ; Ahmad, Ibrahim. / Warpage and wire sweep analysis of QFN molded strip using experimental and modeling methods. Proceedings of the Electronic Packaging Technology Conference, EPTC. 2007. pp. 494-498
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