Wafer dice process improvement using Six Sigma approach

Z. Jamaluddin, Ahmad Mahir Razali, Zainol Mustafa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Quality is an important objective in production or operational function. In mass production, a high accuracy manufacture line, better quality and less variance are inevitable. Six Sigma is customer oriented, improving the whole process by using data and statistical method for enhancing quality management. The main barrier in achieving targeted quality is product variation which causes by differences in machines, suppliers, raw materials and production batch. If the product variation is uncontrolled, the product needs to be reworked. Six Sigma approach focuses on quality improvement by eliminating variation in manufacturing process. In this paper, the use of quality techniques in Six Sigma methods for process improvement by electronic component manufacturing company is discussed. Six Sigma method by DMAIC approach is proposed to reduce defect rate of wafer dice processing. The optimum parameters were established through the design of experiment to ensure the process was stable.

Original languageEnglish
Title of host publication2011 IEEE International Conference on Quality and Reliability, ICQR 2011
Pages31-35
Number of pages5
DOIs
Publication statusPublished - 2011
Event2011 IEEE International Conference on Quality and Reliability, ICQR 2011 - Bangkok
Duration: 14 Sep 201117 Sep 2011

Other

Other2011 IEEE International Conference on Quality and Reliability, ICQR 2011
CityBangkok
Period14/9/1117/9/11

Fingerprint

Quality management
Design of experiments
Statistical methods
Raw materials
Defects
Six sigma
Processing
Industry

Keywords

  • Design of Experiments
  • Quality improvement
  • Quality Management
  • Six Sigma

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality

Cite this

Jamaluddin, Z., Razali, A. M., & Mustafa, Z. (2011). Wafer dice process improvement using Six Sigma approach. In 2011 IEEE International Conference on Quality and Reliability, ICQR 2011 (pp. 31-35). [6031676] https://doi.org/10.1109/ICQR.2011.6031676

Wafer dice process improvement using Six Sigma approach. / Jamaluddin, Z.; Razali, Ahmad Mahir; Mustafa, Zainol.

2011 IEEE International Conference on Quality and Reliability, ICQR 2011. 2011. p. 31-35 6031676.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jamaluddin, Z, Razali, AM & Mustafa, Z 2011, Wafer dice process improvement using Six Sigma approach. in 2011 IEEE International Conference on Quality and Reliability, ICQR 2011., 6031676, pp. 31-35, 2011 IEEE International Conference on Quality and Reliability, ICQR 2011, Bangkok, 14/9/11. https://doi.org/10.1109/ICQR.2011.6031676
Jamaluddin Z, Razali AM, Mustafa Z. Wafer dice process improvement using Six Sigma approach. In 2011 IEEE International Conference on Quality and Reliability, ICQR 2011. 2011. p. 31-35. 6031676 https://doi.org/10.1109/ICQR.2011.6031676
Jamaluddin, Z. ; Razali, Ahmad Mahir ; Mustafa, Zainol. / Wafer dice process improvement using Six Sigma approach. 2011 IEEE International Conference on Quality and Reliability, ICQR 2011. 2011. pp. 31-35
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