Ultrasonic vibration in leadframe for the bondability for Au wedge bond

Roslina Ismail, Fuaida Harun, Azman Jalar @ Jalil, Shahrum Abdullah

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The in-situ inspection of ultrasonic vibration of wire bonder capillary was carried out using laser interferometer in order to analyze the formation of Au wedge bond. It was observed that the changes in ultrasonic vibration can be used to describe process of bonding formation. The loss of ultrasonic energy was exhibited in ultrasonic vibration waveform of wire bonding on leadframe A. This observation is due to the low frictional energy and high deformation of Au wedge bond on leadframe A. The lower pull strength obtained by Au wedge bond further confirms the reduction of bond formation on leadframe A.

Original languageEnglish
Title of host publicationMaterials Science Forum
PublisherTrans Tech Publications Ltd
Pages83-86
Number of pages4
Volume857
ISBN (Print)9783035710205
DOIs
Publication statusPublished - 2016
EventInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China
Duration: 4 Dec 20155 Dec 2015

Publication series

NameMaterials Science Forum
Volume857
ISSN (Print)02555476

Other

OtherInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015
CountryTaiwan, Province of China
CityKaohsiung
Period4/12/155/12/15

Fingerprint

wedges
Vibrations (mechanical)
ultrasonics
Ultrasonics
vibration
wire
Wire
Interferometers
inspection
waveforms
interferometers
Inspection
energy
Lasers
lasers

Keywords

  • Au wedge bond
  • Bondability
  • Ultrasonic vibration
  • Wire bonding

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Ismail, R., Harun, F., Jalar @ Jalil, A., & Abdullah, S. (2016). Ultrasonic vibration in leadframe for the bondability for Au wedge bond. In Materials Science Forum (Vol. 857, pp. 83-86). (Materials Science Forum; Vol. 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.83

Ultrasonic vibration in leadframe for the bondability for Au wedge bond. / Ismail, Roslina; Harun, Fuaida; Jalar @ Jalil, Azman; Abdullah, Shahrum.

Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. p. 83-86 (Materials Science Forum; Vol. 857).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ismail, R, Harun, F, Jalar @ Jalil, A & Abdullah, S 2016, Ultrasonic vibration in leadframe for the bondability for Au wedge bond. in Materials Science Forum. vol. 857, Materials Science Forum, vol. 857, Trans Tech Publications Ltd, pp. 83-86, International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, Province of China, 4/12/15. https://doi.org/10.4028/www.scientific.net/MSF.857.83
Ismail R, Harun F, Jalar @ Jalil A, Abdullah S. Ultrasonic vibration in leadframe for the bondability for Au wedge bond. In Materials Science Forum. Vol. 857. Trans Tech Publications Ltd. 2016. p. 83-86. (Materials Science Forum). https://doi.org/10.4028/www.scientific.net/MSF.857.83
Ismail, Roslina ; Harun, Fuaida ; Jalar @ Jalil, Azman ; Abdullah, Shahrum. / Ultrasonic vibration in leadframe for the bondability for Au wedge bond. Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. pp. 83-86 (Materials Science Forum).
@inproceedings{4b713482f54e46eaa4957493d16f22fb,
title = "Ultrasonic vibration in leadframe for the bondability for Au wedge bond",
abstract = "The in-situ inspection of ultrasonic vibration of wire bonder capillary was carried out using laser interferometer in order to analyze the formation of Au wedge bond. It was observed that the changes in ultrasonic vibration can be used to describe process of bonding formation. The loss of ultrasonic energy was exhibited in ultrasonic vibration waveform of wire bonding on leadframe A. This observation is due to the low frictional energy and high deformation of Au wedge bond on leadframe A. The lower pull strength obtained by Au wedge bond further confirms the reduction of bond formation on leadframe A.",
keywords = "Au wedge bond, Bondability, Ultrasonic vibration, Wire bonding",
author = "Roslina Ismail and Fuaida Harun and {Jalar @ Jalil}, Azman and Shahrum Abdullah",
year = "2016",
doi = "10.4028/www.scientific.net/MSF.857.83",
language = "English",
isbn = "9783035710205",
volume = "857",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd",
pages = "83--86",
booktitle = "Materials Science Forum",

}

TY - GEN

T1 - Ultrasonic vibration in leadframe for the bondability for Au wedge bond

AU - Ismail, Roslina

AU - Harun, Fuaida

AU - Jalar @ Jalil, Azman

AU - Abdullah, Shahrum

PY - 2016

Y1 - 2016

N2 - The in-situ inspection of ultrasonic vibration of wire bonder capillary was carried out using laser interferometer in order to analyze the formation of Au wedge bond. It was observed that the changes in ultrasonic vibration can be used to describe process of bonding formation. The loss of ultrasonic energy was exhibited in ultrasonic vibration waveform of wire bonding on leadframe A. This observation is due to the low frictional energy and high deformation of Au wedge bond on leadframe A. The lower pull strength obtained by Au wedge bond further confirms the reduction of bond formation on leadframe A.

AB - The in-situ inspection of ultrasonic vibration of wire bonder capillary was carried out using laser interferometer in order to analyze the formation of Au wedge bond. It was observed that the changes in ultrasonic vibration can be used to describe process of bonding formation. The loss of ultrasonic energy was exhibited in ultrasonic vibration waveform of wire bonding on leadframe A. This observation is due to the low frictional energy and high deformation of Au wedge bond on leadframe A. The lower pull strength obtained by Au wedge bond further confirms the reduction of bond formation on leadframe A.

KW - Au wedge bond

KW - Bondability

KW - Ultrasonic vibration

KW - Wire bonding

UR - http://www.scopus.com/inward/record.url?scp=84961262753&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84961262753&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/MSF.857.83

DO - 10.4028/www.scientific.net/MSF.857.83

M3 - Conference contribution

AN - SCOPUS:84961262753

SN - 9783035710205

VL - 857

T3 - Materials Science Forum

SP - 83

EP - 86

BT - Materials Science Forum

PB - Trans Tech Publications Ltd

ER -