Tio2 nanoparticles reinforced lead-free 96.5Sn-3.0Ag-0.5CU solder paste for ultra-fine package assembly in reflow soldering process

F. Che Ani, Azman Jalar @ Jalil, R. Ismail, Z. Mustafa, A. A. Saad, C. Y. Khor, Norinsan Kamil Othman, M. Y. Tura Ali, M. A.F.M. Mukhtar, A. Abas

Research output: Contribution to journalArticle

Abstract

Ultra-fine package assembly using TiO2 nanoparticle reinforced lead-free solder paste was carried out in the reflow soldering process. TiO2 nanoparticles were mixed with the SAC solder paste at 0.01, 0.05 and 0.15 wt.%. The ultra-fine package (passive capacitor) was mounted on PCB with a thickness of 2.0 mm using the nanocomposite solders. Voids, microstructure and TiO2 nanoparticle distributions were inspected through the X-ray, SEM and HRTEM. The ultra-fine solder joints were formed perfectly without any void formation. The TiO2 nanoparticles are distributed homogenously in the solder joint. The mechanism of IMC reaction during the reflow soldering process is also discussed. Homogeneous mixing of nanoparticle plays a significant role for the distribution of the nanoparticle in the solder joint.

Original languageEnglish
Pages (from-to)413-424
Number of pages12
JournalJournal of Advanced Manufacturing Technology
Volume12
Issue number1 Special Issue 2
Publication statusPublished - 1 Jan 2018

Fingerprint

Adhesive pastes
TiO2
Soldering
Soldering alloys
Nanoparticles
Lead
Solder Joint
Voids
Nanocomposites
Capacitor
Polychlorinated biphenyls
Microstructure
Capacitors
X rays
Scanning electron microscopy

Keywords

  • Composite Solder
  • SAC305
  • Titanium Dioxide Nanoparticle
  • Ultra-fine Package

ASJC Scopus subject areas

  • Software
  • Automotive Engineering
  • Hardware and Architecture
  • Computer Networks and Communications
  • Control and Optimization
  • Industrial and Manufacturing Engineering
  • Management of Technology and Innovation

Cite this

Tio2 nanoparticles reinforced lead-free 96.5Sn-3.0Ag-0.5CU solder paste for ultra-fine package assembly in reflow soldering process. / Che Ani, F.; Jalar @ Jalil, Azman; Ismail, R.; Mustafa, Z.; Saad, A. A.; Khor, C. Y.; Othman, Norinsan Kamil; Tura Ali, M. Y.; Mukhtar, M. A.F.M.; Abas, A.

In: Journal of Advanced Manufacturing Technology, Vol. 12, No. 1 Special Issue 2, 01.01.2018, p. 413-424.

Research output: Contribution to journalArticle

Che Ani, F, Jalar @ Jalil, A, Ismail, R, Mustafa, Z, Saad, AA, Khor, CY, Othman, NK, Tura Ali, MY, Mukhtar, MAFM & Abas, A 2018, 'Tio2 nanoparticles reinforced lead-free 96.5Sn-3.0Ag-0.5CU solder paste for ultra-fine package assembly in reflow soldering process', Journal of Advanced Manufacturing Technology, vol. 12, no. 1 Special Issue 2, pp. 413-424.
Che Ani, F. ; Jalar @ Jalil, Azman ; Ismail, R. ; Mustafa, Z. ; Saad, A. A. ; Khor, C. Y. ; Othman, Norinsan Kamil ; Tura Ali, M. Y. ; Mukhtar, M. A.F.M. ; Abas, A. / Tio2 nanoparticles reinforced lead-free 96.5Sn-3.0Ag-0.5CU solder paste for ultra-fine package assembly in reflow soldering process. In: Journal of Advanced Manufacturing Technology. 2018 ; Vol. 12, No. 1 Special Issue 2. pp. 413-424.
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AU - Saad, A. A.

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AU - Othman, Norinsan Kamil

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