Time influence on thickness and grains for molybdenum thin film

Muhtade Mustafa Aqil, Mohd Asyadi Azam, Latif Rhonira, Fauziyah Salehuddin

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

In this paper, DC magnetron sputtering technique was used to deposit high purity molybdenum (Mo) thin films on blank Si substrate. The deposition condition for all samples has not been changed except for the deposition time in order to study the time influence on the surface morphology of the molybdenum. The surface profiler has been sued to measure the surface thickness. Atomic force microscopy technique was employed to investigate grain structure of Mo thin film. Grains analysis and thickness for all samples show a direct relation with time. The thickness and grain parameters of molybdenum thin films increase with respect to time. Grain area, size, length and perimeter parameters are used in grain analysis.

Original languageEnglish
Pages (from-to)69-73
Number of pages5
JournalJournal of Telecommunication, Electronic and Computer Engineering
Volume9
Issue number2-13
Publication statusPublished - 2017

Fingerprint

Molybdenum
Thin films
Crystal microstructure
Magnetron sputtering
Surface morphology
Atomic force microscopy
Deposits
Substrates

Keywords

  • Atomic Force Microscopy
  • DC Magnetron Sputtering
  • Surface Profile
  • Thin Film

ASJC Scopus subject areas

  • Hardware and Architecture
  • Computer Networks and Communications
  • Electrical and Electronic Engineering

Cite this

Time influence on thickness and grains for molybdenum thin film. / Aqil, Muhtade Mustafa; Azam, Mohd Asyadi; Rhonira, Latif; Salehuddin, Fauziyah.

In: Journal of Telecommunication, Electronic and Computer Engineering, Vol. 9, No. 2-13, 2017, p. 69-73.

Research output: Contribution to journalArticle

Aqil, Muhtade Mustafa ; Azam, Mohd Asyadi ; Rhonira, Latif ; Salehuddin, Fauziyah. / Time influence on thickness and grains for molybdenum thin film. In: Journal of Telecommunication, Electronic and Computer Engineering. 2017 ; Vol. 9, No. 2-13. pp. 69-73.
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