Three-point bending test behaviour of a QFN semiconductor package

Shahrum Abdullah, Mohd Faridz Mod Yunoh, Azman Jalar @ Jalil

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper discusses some issues in micromechanical property of a newly developed Quad Flat No-lead (QFN) 3D stacked die package using three-point bending test approach. The relevant test methodologies were carried out in order to observe the flexural stress, strain, maximum load and deflection of the package. While performing the test, these QFN packages were positioned on the three points test bench, and the specific applied load was then applied and moved down until the package was clearly bent and broken. The related findings indicated that the maximum load was found to be at 251.52 N and the maximum deflection was obtained at 0.41 mm. The results were important for setting related testing parameters (load, stress and strain) before applying the three point cyclic bending test on the QFN stacked die package as the future work.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages7-10
Number of pages4
Volume97-101
DOIs
Publication statusPublished - 2010
Event2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009 - Zhuhai
Duration: 26 Dec 200928 Dec 2009

Publication series

NameAdvanced Materials Research
Volume97-101
ISSN (Print)10226680

Other

Other2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009
CityZhuhai
Period26/12/0928/12/09

Fingerprint

Bending tests
Lead
Semiconductor materials
Loads (forces)
Testing

Keywords

  • Deflection
  • Load
  • QFN
  • Strength
  • Three point bending test

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Abdullah, S., Yunoh, M. F. M., & Jalar @ Jalil, A. (2010). Three-point bending test behaviour of a QFN semiconductor package. In Advanced Materials Research (Vol. 97-101, pp. 7-10). (Advanced Materials Research; Vol. 97-101). https://doi.org/10.4028/www.scientific.net/AMR.97-101.7

Three-point bending test behaviour of a QFN semiconductor package. / Abdullah, Shahrum; Yunoh, Mohd Faridz Mod; Jalar @ Jalil, Azman.

Advanced Materials Research. Vol. 97-101 2010. p. 7-10 (Advanced Materials Research; Vol. 97-101).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abdullah, S, Yunoh, MFM & Jalar @ Jalil, A 2010, Three-point bending test behaviour of a QFN semiconductor package. in Advanced Materials Research. vol. 97-101, Advanced Materials Research, vol. 97-101, pp. 7-10, 2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009, Zhuhai, 26/12/09. https://doi.org/10.4028/www.scientific.net/AMR.97-101.7
Abdullah S, Yunoh MFM, Jalar @ Jalil A. Three-point bending test behaviour of a QFN semiconductor package. In Advanced Materials Research. Vol. 97-101. 2010. p. 7-10. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.97-101.7
Abdullah, Shahrum ; Yunoh, Mohd Faridz Mod ; Jalar @ Jalil, Azman. / Three-point bending test behaviour of a QFN semiconductor package. Advanced Materials Research. Vol. 97-101 2010. pp. 7-10 (Advanced Materials Research).
@inproceedings{5d30822d2b6d4f4687d798ffda1c36e8,
title = "Three-point bending test behaviour of a QFN semiconductor package",
abstract = "This paper discusses some issues in micromechanical property of a newly developed Quad Flat No-lead (QFN) 3D stacked die package using three-point bending test approach. The relevant test methodologies were carried out in order to observe the flexural stress, strain, maximum load and deflection of the package. While performing the test, these QFN packages were positioned on the three points test bench, and the specific applied load was then applied and moved down until the package was clearly bent and broken. The related findings indicated that the maximum load was found to be at 251.52 N and the maximum deflection was obtained at 0.41 mm. The results were important for setting related testing parameters (load, stress and strain) before applying the three point cyclic bending test on the QFN stacked die package as the future work.",
keywords = "Deflection, Load, QFN, Strength, Three point bending test",
author = "Shahrum Abdullah and Yunoh, {Mohd Faridz Mod} and {Jalar @ Jalil}, Azman",
year = "2010",
doi = "10.4028/www.scientific.net/AMR.97-101.7",
language = "English",
isbn = "0878492801",
volume = "97-101",
series = "Advanced Materials Research",
pages = "7--10",
booktitle = "Advanced Materials Research",

}

TY - GEN

T1 - Three-point bending test behaviour of a QFN semiconductor package

AU - Abdullah, Shahrum

AU - Yunoh, Mohd Faridz Mod

AU - Jalar @ Jalil, Azman

PY - 2010

Y1 - 2010

N2 - This paper discusses some issues in micromechanical property of a newly developed Quad Flat No-lead (QFN) 3D stacked die package using three-point bending test approach. The relevant test methodologies were carried out in order to observe the flexural stress, strain, maximum load and deflection of the package. While performing the test, these QFN packages were positioned on the three points test bench, and the specific applied load was then applied and moved down until the package was clearly bent and broken. The related findings indicated that the maximum load was found to be at 251.52 N and the maximum deflection was obtained at 0.41 mm. The results were important for setting related testing parameters (load, stress and strain) before applying the three point cyclic bending test on the QFN stacked die package as the future work.

AB - This paper discusses some issues in micromechanical property of a newly developed Quad Flat No-lead (QFN) 3D stacked die package using three-point bending test approach. The relevant test methodologies were carried out in order to observe the flexural stress, strain, maximum load and deflection of the package. While performing the test, these QFN packages were positioned on the three points test bench, and the specific applied load was then applied and moved down until the package was clearly bent and broken. The related findings indicated that the maximum load was found to be at 251.52 N and the maximum deflection was obtained at 0.41 mm. The results were important for setting related testing parameters (load, stress and strain) before applying the three point cyclic bending test on the QFN stacked die package as the future work.

KW - Deflection

KW - Load

KW - QFN

KW - Strength

KW - Three point bending test

UR - http://www.scopus.com/inward/record.url?scp=77951014397&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77951014397&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/AMR.97-101.7

DO - 10.4028/www.scientific.net/AMR.97-101.7

M3 - Conference contribution

AN - SCOPUS:77951014397

SN - 0878492801

SN - 9780878492800

VL - 97-101

T3 - Advanced Materials Research

SP - 7

EP - 10

BT - Advanced Materials Research

ER -