Thin film crystal growth template removal

Application to stress reduction in lead zirconate titanate microstructures

P. Gkotsis, P. B. Kirby, F. Saharil, J. Oberhammer, G. Stemme

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A key issue for the design and reliability of microdevices is process related; residual stresses in the thin films from which they are composed, especially for sol-gel deposited Pb (Zrx, Ti1-x) O3 ceramics, where use of Pt as a template layer, though essential for the nucleation of the perovskite phase, results in structures with high levels of stress largely fixed by the thermal expansion coefficient mismatch between Pt and Si. Here a technique for the elimination of this stress is presented, involving the use of adhesive wafer bonding and bulk micromachining procedures to remove the Pt layer following the Pb (Zrx, Ti1-x) O3 deposition.

Original languageEnglish
Article number163504
JournalApplied Physics Letters
Volume91
Issue number16
DOIs
Publication statusPublished - 2007
Externally publishedYes

Fingerprint

crystal growth
templates
microstructure
micromachining
thin films
adhesives
residual stress
elimination
thermal expansion
nucleation
wafers
gels
ceramics
coefficients

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Thin film crystal growth template removal : Application to stress reduction in lead zirconate titanate microstructures. / Gkotsis, P.; Kirby, P. B.; Saharil, F.; Oberhammer, J.; Stemme, G.

In: Applied Physics Letters, Vol. 91, No. 16, 163504, 2007.

Research output: Contribution to journalArticle

Gkotsis, P. ; Kirby, P. B. ; Saharil, F. ; Oberhammer, J. ; Stemme, G. / Thin film crystal growth template removal : Application to stress reduction in lead zirconate titanate microstructures. In: Applied Physics Letters. 2007 ; Vol. 91, No. 16.
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