Thermal-mechanical analysis of a different leadframe thickness of semiconductor package under the reflow process

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1 Citation (Scopus)

Abstract

The copper-based leadframe is practically proven effective in the thermal and reliability of a Quad Flat No Lead (QFN) three dimension (3D) stacked-die semiconductor package. Reducing the copper thickness is understood to present various thermal and reliability failure mode and mechanisms, such as die cracking and delamination. However, no in-depth study has been pursued in order to determine the capability of achieving the product requirements in terms of thermal and reliability in a 3D stacked-die package. The drive towards a Die-Free Package Cost (DFPC) reduction has led the authors to study the used of a thin leadframe in a QFN 3D stacked-die. Hence, the work presents basis for the qualification of a thin leadframe design and also to demonstrate the thermal and reliability performance. Finally, an extensive virtual thermal-mechanical prototyping has to be achieved in order to understand the physics of materials during the assembly and reliability testing of a 3D stacked-die package with a thin leadframe. This design rule was found to be developed in order to prevent a die crack occurrence between die and leadframe in the semiconductor package.

Original languageEnglish
Pages (from-to)616-625
Number of pages10
JournalAmerican Journal of Applied Sciences
Volume6
Issue number4
DOIs
Publication statusPublished - 2009

Fingerprint

Semiconductor materials
Lead
Copper
Hot Temperature
Cost reduction
Delamination
Failure modes
Physics
Cracks
Testing

Keywords

  • 3D stacked-die
  • Design
  • Leadframe
  • QFN
  • Stress
  • Thermo-mechanical

ASJC Scopus subject areas

  • General

Cite this

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title = "Thermal-mechanical analysis of a different leadframe thickness of semiconductor package under the reflow process",
abstract = "The copper-based leadframe is practically proven effective in the thermal and reliability of a Quad Flat No Lead (QFN) three dimension (3D) stacked-die semiconductor package. Reducing the copper thickness is understood to present various thermal and reliability failure mode and mechanisms, such as die cracking and delamination. However, no in-depth study has been pursued in order to determine the capability of achieving the product requirements in terms of thermal and reliability in a 3D stacked-die package. The drive towards a Die-Free Package Cost (DFPC) reduction has led the authors to study the used of a thin leadframe in a QFN 3D stacked-die. Hence, the work presents basis for the qualification of a thin leadframe design and also to demonstrate the thermal and reliability performance. Finally, an extensive virtual thermal-mechanical prototyping has to be achieved in order to understand the physics of materials during the assembly and reliability testing of a 3D stacked-die package with a thin leadframe. This design rule was found to be developed in order to prevent a die crack occurrence between die and leadframe in the semiconductor package.",
keywords = "3D stacked-die, Design, Leadframe, QFN, Stress, Thermo-mechanical",
author = "Shahrum Abdullah and Abdullah, {M. F.} and {Mohd Ihsan}, {Ahmad Kamal Ariffin} and {Jalar @ Jalil}, Azman",
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AU - Abdullah, M. F.

AU - Mohd Ihsan, Ahmad Kamal Ariffin

AU - Jalar @ Jalil, Azman

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AB - The copper-based leadframe is practically proven effective in the thermal and reliability of a Quad Flat No Lead (QFN) three dimension (3D) stacked-die semiconductor package. Reducing the copper thickness is understood to present various thermal and reliability failure mode and mechanisms, such as die cracking and delamination. However, no in-depth study has been pursued in order to determine the capability of achieving the product requirements in terms of thermal and reliability in a 3D stacked-die package. The drive towards a Die-Free Package Cost (DFPC) reduction has led the authors to study the used of a thin leadframe in a QFN 3D stacked-die. Hence, the work presents basis for the qualification of a thin leadframe design and also to demonstrate the thermal and reliability performance. Finally, an extensive virtual thermal-mechanical prototyping has to be achieved in order to understand the physics of materials during the assembly and reliability testing of a 3D stacked-die package with a thin leadframe. This design rule was found to be developed in order to prevent a die crack occurrence between die and leadframe in the semiconductor package.

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KW - Stress

KW - Thermo-mechanical

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