Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)

M. Mazlan, A. Rahim, A. M. Mustafa Al Bakri, W. Razak, A. F. Zubair, Y. M. Najib, A. Azman Bakir

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four microprocessors arranged in line under different types of materials, inlet velocities and package (chip) powers. The results are presented in terms of averagejunction temperature and thermal resistance of each package Thejunction temperature is been observed and it was found that the junction temperature of the microprocessors is not exceed 70° C. It also found that the (chip) powers and inlet velocities are the most important elements to control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages141-147
Number of pages7
Volume795
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2nd International Conference on Sustainable Materials, ICoSM 2013 - Penang
Duration: 26 Mar 201327 Mar 2013

Publication series

NameAdvanced Materials Research
Volume795
ISSN (Print)10226680

Other

Other2nd International Conference on Sustainable Materials, ICoSM 2013
CityPenang
Period26/3/1327/3/13

Fingerprint

Temperature control
Microprocessor chips
Computational fluid dynamics
Silver
Composite materials
Heat transfer
Temperature
Heat resistance
Numerical analysis
Flow of fluids

Keywords

  • Average junction temperature
  • Microprocessors
  • Nanomaterial
  • Thermal Management

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Mazlan, M., Rahim, A., Mustafa Al Bakri, A. M., Razak, W., Zubair, A. F., Najib, Y. M., & Azman Bakir, A. (2013). Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver). In Advanced Materials Research (Vol. 795, pp. 141-147). (Advanced Materials Research; Vol. 795). https://doi.org/10.4028/www.scientific.net/AMR.795.141

Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver). / Mazlan, M.; Rahim, A.; Mustafa Al Bakri, A. M.; Razak, W.; Zubair, A. F.; Najib, Y. M.; Azman Bakir, A.

Advanced Materials Research. Vol. 795 2013. p. 141-147 (Advanced Materials Research; Vol. 795).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mazlan, M, Rahim, A, Mustafa Al Bakri, AM, Razak, W, Zubair, AF, Najib, YM & Azman Bakir, A 2013, Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver). in Advanced Materials Research. vol. 795, Advanced Materials Research, vol. 795, pp. 141-147, 2nd International Conference on Sustainable Materials, ICoSM 2013, Penang, 26/3/13. https://doi.org/10.4028/www.scientific.net/AMR.795.141
Mazlan M, Rahim A, Mustafa Al Bakri AM, Razak W, Zubair AF, Najib YM et al. Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver). In Advanced Materials Research. Vol. 795. 2013. p. 141-147. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.795.141
Mazlan, M. ; Rahim, A. ; Mustafa Al Bakri, A. M. ; Razak, W. ; Zubair, A. F. ; Najib, Y. M. ; Azman Bakir, A. / Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver). Advanced Materials Research. Vol. 795 2013. pp. 141-147 (Advanced Materials Research).
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