Abstract
Original language | English |
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Pages | 171-175 |
Number of pages | 5 |
DOIs | |
Publication status | Published - 2003 |
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Thermal characterization and electrical performance of low profile power packages : Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003. / Chiang, N.C.; Nayan, Nazrul Anuar.
2003. 171-175.Research output: Contribution to conference › Paper
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TY - CONF
T1 - Thermal characterization and electrical performance of low profile power packages
T2 - Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003
AU - Chiang, N.C.
AU - Nayan, Nazrul Anuar
N1 - Cited By :2 Export Date: 1 February 2019
PY - 2003
Y1 - 2003
N2 - Increasing demand for low profile and low cost power packages for use in commercial applications drives the development of these packages with competitive cost advantage. The objective of this study is to compare the thermal and electrical performance of thinner version power packages. Both modeling and experimental works are resorted to in order to analyze package robustness. While a large package will guarantee a lower thermal resistance, many applications are very restrictive in terms of the space available for the devices - it is in such applications that a small discrete device has advantages over a module.
AB - Increasing demand for low profile and low cost power packages for use in commercial applications drives the development of these packages with competitive cost advantage. The objective of this study is to compare the thermal and electrical performance of thinner version power packages. Both modeling and experimental works are resorted to in order to analyze package robustness. While a large package will guarantee a lower thermal resistance, many applications are very restrictive in terms of the space available for the devices - it is in such applications that a small discrete device has advantages over a module.
U2 - 10.1109/EPTC.2003.1271511
DO - 10.1109/EPTC.2003.1271511
M3 - Paper
SP - 171
EP - 175
ER -