Thermal characterization and electrical performance of low profile power packages

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

N.C. Chiang, Nazrul Anuar Nayan

Research output: Contribution to conference › Paper

2 Citations (Scopus)

Abstract

Increasing demand for low profile and low cost power packages for use in commercial applications drives the development of these packages with competitive cost advantage. The objective of this study is to compare the thermal and electrical performance of thinner version power packages. Both modeling and experimental works are resorted to in order to analyze package robustness. While a large package will guarantee a lower thermal resistance, many applications are very restrictive in terms of the space available for the devices - it is in such applications that a small discrete device has advantages over a module.
Original languageEnglish
Pages171-175
Number of pages5
DOIs
Publication statusPublished - 2003

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Electronics packaging
Heat resistance
Costs
Hot Temperature

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Thermal characterization and electrical performance of low profile power packages : Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003. / Chiang, N.C.; Nayan, Nazrul Anuar.

2003. 171-175.

Research output: Contribution to conference › Paper

Chiang, NC & Nayan, NA 2003, 'Thermal characterization and electrical performance of low profile power packages: Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003' pp. 171-175. https://doi.org/10.1109/EPTC.2003.1271511
Chiang NC, Nayan NA. Thermal characterization and electrical performance of low profile power packages: Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003. 2003. https://doi.org/10.1109/EPTC.2003.1271511
Chiang, N.C. ; Nayan, Nazrul Anuar. / Thermal characterization and electrical performance of low profile power packages : Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003. 5 p.
@conference{f4597669d1fc4257b78c9427353dfe90,
title = "Thermal characterization and electrical performance of low profile power packages: Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003",
abstract = "Increasing demand for low profile and low cost power packages for use in commercial applications drives the development of these packages with competitive cost advantage. The objective of this study is to compare the thermal and electrical performance of thinner version power packages. Both modeling and experimental works are resorted to in order to analyze package robustness. While a large package will guarantee a lower thermal resistance, many applications are very restrictive in terms of the space available for the devices - it is in such applications that a small discrete device has advantages over a module.",
author = "N.C. Chiang and Nayan, {Nazrul Anuar}",
note = "Cited By :2 Export Date: 1 February 2019",
year = "2003",
doi = "10.1109/EPTC.2003.1271511",
language = "English",
pages = "171--175",

}

TY - CONF

T1 - Thermal characterization and electrical performance of low profile power packages

T2 - Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

AU - Chiang, N.C.

AU - Nayan, Nazrul Anuar

N1 - Cited By :2 Export Date: 1 February 2019

PY - 2003

Y1 - 2003

N2 - Increasing demand for low profile and low cost power packages for use in commercial applications drives the development of these packages with competitive cost advantage. The objective of this study is to compare the thermal and electrical performance of thinner version power packages. Both modeling and experimental works are resorted to in order to analyze package robustness. While a large package will guarantee a lower thermal resistance, many applications are very restrictive in terms of the space available for the devices - it is in such applications that a small discrete device has advantages over a module.

AB - Increasing demand for low profile and low cost power packages for use in commercial applications drives the development of these packages with competitive cost advantage. The objective of this study is to compare the thermal and electrical performance of thinner version power packages. Both modeling and experimental works are resorted to in order to analyze package robustness. While a large package will guarantee a lower thermal resistance, many applications are very restrictive in terms of the space available for the devices - it is in such applications that a small discrete device has advantages over a module.

U2 - 10.1109/EPTC.2003.1271511

DO - 10.1109/EPTC.2003.1271511

M3 - Paper

SP - 171

EP - 175

ER -

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