The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition

Mohd Khairuddin Md Arshad, Ibrahim Ahmad, Azman Jalar @ Jalil, Ghazali Omar

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy (SEM) techniques were used to obtain the surface roughness and morphology of each deposition process. The elemental analysis using Energy Disperse X-Ray (EDX) and precision micro-cross-section using Focus Ion Beam (FIB) was also used in this study. The first zincation process has high surface roughness but preserved surface morphology of initial thin-film surface. The second zincation provides the improved surface roughness due to the replacement aluminum layer with ion zinc in the solution. Smooth surfaces leads to better shear strength. However, second zincation will affect the Al thickness, hence excessive attacks on Al layer may cause reliability problem.

Original languageEnglish
Pages (from-to)367-379
Number of pages13
JournalMicroelectronics Reliability
Volume46
Issue number2-4
DOIs
Publication statusPublished - Feb 2006

Fingerprint

metallurgy
Metallurgy
Nickel
Gold
submerging
Surface roughness
nickel
gold
surface roughness
Surface morphology
Aluminum
Shear strength
Ion beams
Zinc
Atomic force microscopy
shear strength
Ions
attack
X rays
Thin films

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition. / Arshad, Mohd Khairuddin Md; Ahmad, Ibrahim; Jalar @ Jalil, Azman; Omar, Ghazali.

In: Microelectronics Reliability, Vol. 46, No. 2-4, 02.2006, p. 367-379.

Research output: Contribution to journalArticle

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