The study of underfill epoxy hardness in reducing curing process time for flip chip packaging

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill's hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.

Original languageEnglish
Title of host publicationKey Engineering Materials
Pages1194-1199
Number of pages6
Volume462-463
DOIs
Publication statusPublished - 2011
Event8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010 - Kuala Lumpur
Duration: 7 Jun 20109 Jun 2010

Publication series

NameKey Engineering Materials
Volume462-463
ISSN (Print)10139826

Other

Other8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010
CityKuala Lumpur
Period7/6/109/6/10

Fingerprint

Curing
Packaging
Hardness
Ceramic dies
Ball grid arrays
Silicon
Ovens
Thermal stress
Amines
Thermal expansion
Substrates
Temperature

Keywords

  • Ceramic flip chip packaging
  • Curing profile
  • Hardness
  • Nanoindenter
  • Underfill

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

The study of underfill epoxy hardness in reducing curing process time for flip chip packaging. / Kornain, Zainudin; Jalar @ Jalil, Azman; Rasid, Rozaidi; Abdullah, Shahrum.

Key Engineering Materials. Vol. 462-463 2011. p. 1194-1199 (Key Engineering Materials; Vol. 462-463).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kornain, Z, Jalar @ Jalil, A, Rasid, R & Abdullah, S 2011, The study of underfill epoxy hardness in reducing curing process time for flip chip packaging. in Key Engineering Materials. vol. 462-463, Key Engineering Materials, vol. 462-463, pp. 1194-1199, 8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010, Kuala Lumpur, 7/6/10. https://doi.org/10.4028/www.scientific.net/KEM.462-463.1194
Kornain, Zainudin ; Jalar @ Jalil, Azman ; Rasid, Rozaidi ; Abdullah, Shahrum. / The study of underfill epoxy hardness in reducing curing process time for flip chip packaging. Key Engineering Materials. Vol. 462-463 2011. pp. 1194-1199 (Key Engineering Materials).
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