The morphology of Pb-free Sn - 3.0Ag - 0.5Cu solder reinforced by NiO nanoparticles

Fakhrul Rifdi Omar, Emee Marina Salleh, Norinsan Kamil Othman, Fakhrozi Che Ani, Zambri Samsudin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The present study investigates the effects of NiO addition on the mechanical properties and microstructure of the Sn-3.0Ag-0.5Cu (SAC305) solder alloy. In this study, three different solder alloy were prepared by reflow soldering. SAC 305 solder alloys were doped with different percentage of Nickel oxide (NiO) nano-particles content; i.e. 0.01 wt%, 0.05 wt%, and 0.15 wt% in producing nanocomposite solder paste. Electrochemical migration of SAC305-NiO nanocomposites solder pastes was measured using water drop test. Effects of the mean-time-to-failure (MTTF) and the dendrites growth were investigated using optical microscopy.

Original languageEnglish
Title of host publication2018 UKM FST Postgraduate Colloquium
Subtitle of host publicationProceedings of the Universiti Kebangsaan Malaysia, Faculty of Science and Technology 2018 Postgraduate Colloquium
EditorsNoor Hayati Ahmad Rasol, Kamarulzaman Ibrahim, Siti Aishah Hasbullah, Mohammad Hafizuddin Hj. Jumali, Nazlina Ibrahim, Marlia Mohd Hanafiah, Mohd Talib Latif
PublisherAmerican Institute of Physics Inc.
ISBN (Electronic)9780735418431
DOIs
Publication statusPublished - 27 Jun 2019
Event2018 UKM FST Postgraduate Colloquium - Selangor, Malaysia
Duration: 4 Apr 20186 Apr 2018

Publication series

NameAIP Conference Proceedings
Volume2111
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference2018 UKM FST Postgraduate Colloquium
CountryMalaysia
CitySelangor
Period4/4/186/4/18

Fingerprint

nickel oxides
nanoparticles
solders
nickel
oxides
nanocomposites
oxide
dendrites
microstructure
mechanical properties
microscopy
drop tests
mechanical property
soldering
nanoparticle
water
testing
effect

Keywords

  • Corrosion
  • Dendrite
  • Microstructure
  • NiO Nanoparticle
  • SAC305

ASJC Scopus subject areas

  • Ecology, Evolution, Behavior and Systematics
  • Ecology
  • Plant Science
  • Physics and Astronomy(all)
  • Nature and Landscape Conservation

Cite this

Omar, F. R., Salleh, E. M., Othman, N. K., Ani, F. C., & Samsudin, Z. (2019). The morphology of Pb-free Sn - 3.0Ag - 0.5Cu solder reinforced by NiO nanoparticles. In N. H. A. Rasol, K. Ibrahim, S. A. Hasbullah, M. H. H. Jumali, N. Ibrahim, M. M. Hanafiah, & M. T. Latif (Eds.), 2018 UKM FST Postgraduate Colloquium: Proceedings of the Universiti Kebangsaan Malaysia, Faculty of Science and Technology 2018 Postgraduate Colloquium [030005] (AIP Conference Proceedings; Vol. 2111). American Institute of Physics Inc.. https://doi.org/10.1063/1.5111235

The morphology of Pb-free Sn - 3.0Ag - 0.5Cu solder reinforced by NiO nanoparticles. / Omar, Fakhrul Rifdi; Salleh, Emee Marina; Othman, Norinsan Kamil; Ani, Fakhrozi Che; Samsudin, Zambri.

2018 UKM FST Postgraduate Colloquium: Proceedings of the Universiti Kebangsaan Malaysia, Faculty of Science and Technology 2018 Postgraduate Colloquium. ed. / Noor Hayati Ahmad Rasol; Kamarulzaman Ibrahim; Siti Aishah Hasbullah; Mohammad Hafizuddin Hj. Jumali; Nazlina Ibrahim; Marlia Mohd Hanafiah; Mohd Talib Latif. American Institute of Physics Inc., 2019. 030005 (AIP Conference Proceedings; Vol. 2111).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Omar, FR, Salleh, EM, Othman, NK, Ani, FC & Samsudin, Z 2019, The morphology of Pb-free Sn - 3.0Ag - 0.5Cu solder reinforced by NiO nanoparticles. in NHA Rasol, K Ibrahim, SA Hasbullah, MHH Jumali, N Ibrahim, MM Hanafiah & MT Latif (eds), 2018 UKM FST Postgraduate Colloquium: Proceedings of the Universiti Kebangsaan Malaysia, Faculty of Science and Technology 2018 Postgraduate Colloquium., 030005, AIP Conference Proceedings, vol. 2111, American Institute of Physics Inc., 2018 UKM FST Postgraduate Colloquium, Selangor, Malaysia, 4/4/18. https://doi.org/10.1063/1.5111235
Omar FR, Salleh EM, Othman NK, Ani FC, Samsudin Z. The morphology of Pb-free Sn - 3.0Ag - 0.5Cu solder reinforced by NiO nanoparticles. In Rasol NHA, Ibrahim K, Hasbullah SA, Jumali MHH, Ibrahim N, Hanafiah MM, Latif MT, editors, 2018 UKM FST Postgraduate Colloquium: Proceedings of the Universiti Kebangsaan Malaysia, Faculty of Science and Technology 2018 Postgraduate Colloquium. American Institute of Physics Inc. 2019. 030005. (AIP Conference Proceedings). https://doi.org/10.1063/1.5111235
Omar, Fakhrul Rifdi ; Salleh, Emee Marina ; Othman, Norinsan Kamil ; Ani, Fakhrozi Che ; Samsudin, Zambri. / The morphology of Pb-free Sn - 3.0Ag - 0.5Cu solder reinforced by NiO nanoparticles. 2018 UKM FST Postgraduate Colloquium: Proceedings of the Universiti Kebangsaan Malaysia, Faculty of Science and Technology 2018 Postgraduate Colloquium. editor / Noor Hayati Ahmad Rasol ; Kamarulzaman Ibrahim ; Siti Aishah Hasbullah ; Mohammad Hafizuddin Hj. Jumali ; Nazlina Ibrahim ; Marlia Mohd Hanafiah ; Mohd Talib Latif. American Institute of Physics Inc., 2019. (AIP Conference Proceedings).
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