The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging

Roslina Ismail, Ghazali Omar, Azman Jalar @ Jalil, Burhanuddin Yeop Majlis

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Wire bonding processes has been widely adopted in micro-electromechanical systems (MEMS) packaging especially in biomedical devices for the integration of components. In the first process sequence in wire bonding, the zone along the wire near the melted tips is called the heat-affected zone (HAZ). The HAZ plays an important factor that influenced the looping profiles of wire bonding process. This paper investigates the effect of dopants on microstructures in the HAZ. One precent palladium (Pd) was added to the as-drawn 4N gold wire and annealed at 600°C. The addition of Pd was able to moderate the grain growth in the HAZ by retarding the heat propagation to the wire. In the formation of the looping profile, the first bending point of the looping is highly associated with the length of the HAZ. The alloyed gold wire (2N gold) has a sharp angle at a distance of about 30 m from the neck of the wire with a measured bending radius of about 40 mm and bending angle of about 40° clockwise from vertical axis, while the 4N gold wire bends at a longer distance. It also shows that the HAZ for 4N gold is longer than 2N gold wire.

Original languageEnglish
Pages (from-to)2507-2513
Number of pages7
JournalJournal of Electronic Materials
Volume44
Issue number7
DOIs
Publication statusPublished - 4 Jul 2015

Fingerprint

heat affected zone
Palladium
Heat affected zone
packaging
microelectromechanical systems
MEMS
palladium
Packaging
wire
Wire
microstructure
Microstructure
Gold
profiles
gold
Grain growth
Doping (additives)
retarding
heat
radii

Keywords

  • annealing
  • grain structure
  • heat-affected zone
  • Palladium doping

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

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title = "The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging",
abstract = "Wire bonding processes has been widely adopted in micro-electromechanical systems (MEMS) packaging especially in biomedical devices for the integration of components. In the first process sequence in wire bonding, the zone along the wire near the melted tips is called the heat-affected zone (HAZ). The HAZ plays an important factor that influenced the looping profiles of wire bonding process. This paper investigates the effect of dopants on microstructures in the HAZ. One precent palladium (Pd) was added to the as-drawn 4N gold wire and annealed at 600°C. The addition of Pd was able to moderate the grain growth in the HAZ by retarding the heat propagation to the wire. In the formation of the looping profile, the first bending point of the looping is highly associated with the length of the HAZ. The alloyed gold wire (2N gold) has a sharp angle at a distance of about 30 m from the neck of the wire with a measured bending radius of about 40 mm and bending angle of about 40° clockwise from vertical axis, while the 4N gold wire bends at a longer distance. It also shows that the HAZ for 4N gold is longer than 2N gold wire.",
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AU - Yeop Majlis, Burhanuddin

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