The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly

F. Che Ani, Azman Jalar @ Jalil, A. A. Saad, C. Y. Khor, R. Ismail, Z. Bachok, M. A. Abas, Norinsan Kamil Othman

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

This paper presents the influence of Fe2O3 nanoparticles on the microstructure and fillet height for the ultra-fine electronics assembly in the reflow soldering process. Lead-free SAC solder paste was reinforced with different weighted percentages of Fe2O3 nanoparticles (i.e., 0.01, 0.05, and 0.15 wt.%) using a mechanical solder paste mixer. A new form of nano-reinforced lead-free solder paste was applied to assemble the ultra-fine capacitor (i.e., 01005 size) onto the printed circuit board by applying the reflow soldering method. Focused ion beam (FIB), high-resolution transmission electron microscope (HRTEM) system equipped with energy-dispersive X-ray spectroscopy (EDS), field emission scanning electron microscopy coupled with energy-dispersive X-ray spectroscopy (EDS), and nanoindentation tester, were all used to examine the microstructure, hardness, and the fillet height of the solder joints. The experimental results revealed that nano-reinforced solder with the content of 0.01, 0.05, and 0.05 wt% yielded small changes in the intermetallic layers. Furthermore, applying an increment of Fe2O3 to 0.05 wt% also improved the fillet height. The mechanism of the agglomeration of Fe2O3 in the bulk solder is discussed in this study. Moreover, simulation analysis using the volume of fluid (VOF) and discrete phase method (DPM) was both employed to describe the mechanism of nanoparticle distribution in the solder and the reflow soldering process. The findings are expected to provide profound knowledge and further reference towards the reflow soldering process of the miniaturised electronic package.

Original languageEnglish
Pages (from-to)1-17
Number of pages17
JournalInternational Journal of Advanced Manufacturing Technology
DOIs
Publication statusAccepted/In press - 29 Jan 2018

Fingerprint

Soldering alloys
Soldering
Electronic equipment
Nanoparticles
Energy dispersive spectroscopy
Microstructure
Adhesive pastes
Focused ion beams
Nanoindentation
Printed circuit boards
Field emission
Intermetallics
Capacitors
Electron microscopes
Agglomeration
Hardness
Lead-free solders
Scanning electron microscopy
Fluids
X-Ray Emission Spectrometry

Keywords

  • FeO nanoparticle
  • Nano-reinforced lead-free solder
  • SAC305
  • Ultra-fine package

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Software
  • Mechanical Engineering
  • Computer Science Applications
  • Industrial and Manufacturing Engineering

Cite this

The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly. / Che Ani, F.; Jalar @ Jalil, Azman; Saad, A. A.; Khor, C. Y.; Ismail, R.; Bachok, Z.; Abas, M. A.; Othman, Norinsan Kamil.

In: International Journal of Advanced Manufacturing Technology, 29.01.2018, p. 1-17.

Research output: Contribution to journalArticle

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abstract = "This paper presents the influence of Fe2O3 nanoparticles on the microstructure and fillet height for the ultra-fine electronics assembly in the reflow soldering process. Lead-free SAC solder paste was reinforced with different weighted percentages of Fe2O3 nanoparticles (i.e., 0.01, 0.05, and 0.15 wt.{\%}) using a mechanical solder paste mixer. A new form of nano-reinforced lead-free solder paste was applied to assemble the ultra-fine capacitor (i.e., 01005 size) onto the printed circuit board by applying the reflow soldering method. Focused ion beam (FIB), high-resolution transmission electron microscope (HRTEM) system equipped with energy-dispersive X-ray spectroscopy (EDS), field emission scanning electron microscopy coupled with energy-dispersive X-ray spectroscopy (EDS), and nanoindentation tester, were all used to examine the microstructure, hardness, and the fillet height of the solder joints. The experimental results revealed that nano-reinforced solder with the content of 0.01, 0.05, and 0.05 wt{\%} yielded small changes in the intermetallic layers. Furthermore, applying an increment of Fe2O3 to 0.05 wt{\%} also improved the fillet height. The mechanism of the agglomeration of Fe2O3 in the bulk solder is discussed in this study. Moreover, simulation analysis using the volume of fluid (VOF) and discrete phase method (DPM) was both employed to describe the mechanism of nanoparticle distribution in the solder and the reflow soldering process. The findings are expected to provide profound knowledge and further reference towards the reflow soldering process of the miniaturised electronic package.",
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