The effect of underfill fillet geometry to die edge stress for flip chip packaging

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The possible source of die edge cracking for Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to thermal cycling have been investigated in this study. Finite Element Analysis (FEA) models were used to analyze the effect of underfill fillet geometry on interfacial stresses between die edge and the underfill fillet. The input parameters of FC-CBGA from industry was used for simulation and the properties of commercial underfill were extracted by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). Die stress distribution for different fillet height were generated to depict variation of stress due thermal loading. The variation of tensile stress due different fillet height and width were discussed for parameters optimization.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages1108-1111
Number of pages4
Volume148-149
DOIs
Publication statusPublished - 2011
Event2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010 - Shenzhen
Duration: 6 Nov 20108 Nov 2010

Publication series

NameAdvanced Materials Research
Volume148-149
ISSN (Print)10226680

Other

Other2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010
CityShenzhen
Period6/11/108/11/10

Fingerprint

Ball grid arrays
Packaging
Geometry
Thermal cycling
Thermal stress
Tensile stress
Stress concentration
Finite element method
Industry
Hot Temperature

Keywords

  • Die edge crack
  • FC-CBGA
  • Thermal stress
  • Underfill fillet
  • Underfill properties

ASJC Scopus subject areas

  • Engineering(all)

Cite this

The effect of underfill fillet geometry to die edge stress for flip chip packaging. / Jalar @ Jalil, Azman; Kornain, Z.; Rasid, Rozaidi; Abdullah, Shahrum; Othman, Norinsan Kamil.

Advanced Materials Research. Vol. 148-149 2011. p. 1108-1111 (Advanced Materials Research; Vol. 148-149).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jalar @ Jalil, A, Kornain, Z, Rasid, R, Abdullah, S & Othman, NK 2011, The effect of underfill fillet geometry to die edge stress for flip chip packaging. in Advanced Materials Research. vol. 148-149, Advanced Materials Research, vol. 148-149, pp. 1108-1111, 2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010, Shenzhen, 6/11/10. https://doi.org/10.4028/www.scientific.net/AMR.148-149.1108
Jalar @ Jalil, Azman ; Kornain, Z. ; Rasid, Rozaidi ; Abdullah, Shahrum ; Othman, Norinsan Kamil. / The effect of underfill fillet geometry to die edge stress for flip chip packaging. Advanced Materials Research. Vol. 148-149 2011. pp. 1108-1111 (Advanced Materials Research).
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