The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging

Siti Hajar Abdullah, Ibrahim Ahmad, Azman Jalar @ Jalil

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper discusses on the effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging. Double and triple Zincation of ENIG methods were used as comparison study. The effect of number of zincation to surface roughness and surface morphology were investigated. All samples were subjected to reliability tests such as Multiple Reflow, High Temperature Storage Life (HTSL) and Temperature / Thermal Cycle (TC) according to Joint Electron Device Engineering Council (JEDEC) conditions. Scanning Electron Microscope (SEM) and Atomic Force Microscopy (AFM) were used as analytical tools in this study. In multiple reflow tests, no reliability failure found for triple zincation, however for double zincation of ENIG UBM, the failure revealed failure after 3 times of reflow cycle. Thermal fatigue failure for both double and triple zincation of ENIG UBM revealed after 100 hours and 200 hours of HTSL, respectively. For TC test, thermal fatigue failure occurred after 150 cycles, for both double and triple zincation of ENIG UBM. The external and internal crack observed for this failure. The crack growth for double zincation is always much bigger than the triple zincation of ENIG UBM for both HTSL and TC tests. As conclusion, triple zincation gives a better surface morphology of electroless nickel. Hence, it can achieve a reliable solder joint leads to better adhesion between UBM and solder ball therefore, it can achieve a reliable solder joint.

Original languageEnglish
Title of host publication2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings
Pages605-610
Number of pages6
DOIs
Publication statusPublished - 2006
Event2006 25th International Conference on Microelectronics, MIEL 2006 - Belgrade
Duration: 14 May 200617 May 2006

Other

Other2006 25th International Conference on Microelectronics, MIEL 2006
CityBelgrade
Period14/5/0617/5/06

Fingerprint

Metallurgy
Microelectronics
Packaging
Gold
Nickel
Soldering alloys
Thermal fatigue
Surface morphology
Electron devices
Temperature
Crack propagation
Atomic force microscopy
Electron microscopes
Adhesion
Surface roughness
Cracks
Scanning
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Abdullah, S. H., Ahmad, I., & Jalar @ Jalil, A. (2006). The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging. In 2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings (pp. 605-610). [1651029] https://doi.org/10.1109/ICMEL.2006.1651029

The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging. / Abdullah, Siti Hajar; Ahmad, Ibrahim; Jalar @ Jalil, Azman.

2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings. 2006. p. 605-610 1651029.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abdullah, SH, Ahmad, I & Jalar @ Jalil, A 2006, The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging. in 2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings., 1651029, pp. 605-610, 2006 25th International Conference on Microelectronics, MIEL 2006, Belgrade, 14/5/06. https://doi.org/10.1109/ICMEL.2006.1651029
Abdullah, Siti Hajar ; Ahmad, Ibrahim ; Jalar @ Jalil, Azman. / The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging. 2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings. 2006. pp. 605-610
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abstract = "This paper discusses on the effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging. Double and triple Zincation of ENIG methods were used as comparison study. The effect of number of zincation to surface roughness and surface morphology were investigated. All samples were subjected to reliability tests such as Multiple Reflow, High Temperature Storage Life (HTSL) and Temperature / Thermal Cycle (TC) according to Joint Electron Device Engineering Council (JEDEC) conditions. Scanning Electron Microscope (SEM) and Atomic Force Microscopy (AFM) were used as analytical tools in this study. In multiple reflow tests, no reliability failure found for triple zincation, however for double zincation of ENIG UBM, the failure revealed failure after 3 times of reflow cycle. Thermal fatigue failure for both double and triple zincation of ENIG UBM revealed after 100 hours and 200 hours of HTSL, respectively. For TC test, thermal fatigue failure occurred after 150 cycles, for both double and triple zincation of ENIG UBM. The external and internal crack observed for this failure. The crack growth for double zincation is always much bigger than the triple zincation of ENIG UBM for both HTSL and TC tests. As conclusion, triple zincation gives a better surface morphology of electroless nickel. Hence, it can achieve a reliable solder joint leads to better adhesion between UBM and solder ball therefore, it can achieve a reliable solder joint.",
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