The effect of leadframe oxidation of a quad flat no-lead semiconductor package under cyclic loading

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

This study presents a new cyclic test for the QFN package using the oxidised leadframe and good leadframe, namely the three-point assembly fixture with a rounded contact surface test method. The fixture of the test method is a test assembly that supports a specimen on two anvils or rollers and symmetrically loads the specimen on the opposite surface with an anvil or roller using Micro Tester; a micro tensile tester incorporating a deflection measuring device shall be used to generate a controlled board deflection rate. The validity of the mechanical test method can then be verified based on the stress analysis results and also be obtained in the experiments. Considering the QFN package delamination, lead cracking, package body cracking and cracking between the various lead statistically based on the experiments, it was shown during cyclic loads and the temperature conditions for the QFN package for delamination can be observed.

Original languageEnglish
Pages (from-to)1676-1683
Number of pages8
JournalJournal of Applied Sciences
Volume8
Issue number9
DOIs
Publication statusPublished - 2008

Fingerprint

Delamination
Lead
Semiconductor materials
Oxidation
Cyclic loads
Stress analysis
Experiments
Temperature

Keywords

  • Cyclic test
  • Good leadframe
  • Oxidised leadframe
  • QFN package
  • Thermal cycle

ASJC Scopus subject areas

  • General

Cite this

The effect of leadframe oxidation of a quad flat no-lead semiconductor package under cyclic loading. / Abdullah, Shahrum; Abdullah, Mohamad Faizal; Mohd Ihsan, Ahmad Kamal Ariffin.

In: Journal of Applied Sciences, Vol. 8, No. 9, 2008, p. 1676-1683.

Research output: Contribution to journalArticle

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