The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA

Nowshad Amin, Ang Ye Cheah, Zainudin Kornain, Ibrahim Ahmad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Five different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of eutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the eutectic solder bump processed with different types of flux. Various types of clean and no-clean flux are measured and placed on top of silicon die. The effect of the flux has been observed by measuring the spreading area of the eutectic solder bump processed with different types of clean and no-clean fluxes by using Leica Quin Colour (RGB) after the heat treatment. Comparative studies on clean and no-clean fluxes are therefore obtained. Clean flux has shown better wettability on the high lead solder pad proving it to be the optimum choice as also supported by the die pull results. Moreover, the fluxes are tested under thermal gravimetric analyzer (TGA) to observe the flux weight loss on the melting point of eutectic solder bump to correlate with the earlier results.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
Pages393-397
Number of pages5
DOIs
Publication statusPublished - 2008
Event2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008 - Johor Bahru, Johor
Duration: 25 Nov 200827 Nov 2008

Other

Other2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008
CityJohor Bahru, Johor
Period25/11/0827/11/08

Fingerprint

Soldering alloys
Eutectics
Wetting
Fluxes
Silicon
Melting point
Lead
Heat treatment
Color

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Amin, N., Cheah, A. Y., Kornain, Z., & Ahmad, I. (2008). The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 393-397). [4770347] https://doi.org/10.1109/SMELEC.2008.4770347

The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA. / Amin, Nowshad; Cheah, Ang Ye; Kornain, Zainudin; Ahmad, Ibrahim.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 393-397 4770347.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Amin, N, Cheah, AY, Kornain, Z & Ahmad, I 2008, The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA. in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 4770347, pp. 393-397, 2008 IEEE International Conference on Semiconductor Electronics, ICSE 2008, Johor Bahru, Johor, 25/11/08. https://doi.org/10.1109/SMELEC.2008.4770347
Amin N, Cheah AY, Kornain Z, Ahmad I. The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. p. 393-397. 4770347 https://doi.org/10.1109/SMELEC.2008.4770347
Amin, Nowshad ; Cheah, Ang Ye ; Kornain, Zainudin ; Ahmad, Ibrahim. / The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA. IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2008. pp. 393-397
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