The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)

M. Mazlan, A. Rahim, M. A. Iqbal, A. M. Mustafa Al Bakri, W. Razak, M. R. Mohd Sukhairi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel is carried out using a commercial CFD code, FLUENT™ by using Epoxy Moulding Compound (EMC) as a main material. The study was made for four and eight packages with different Reynolds Number and package chip powers. The results are presented in term of junction temperature for four and eight PLCC package under different conditions. It is observed the chip temperatures of eight PLCC packages have higher junction temperature compare to four PLCC packages due to effect of other PLCC because of space and gap between PLCC that have more number of PLCC is smaller. Hence it makes junction temperature of eight PLCC higher compare to four PLCC packages. Moreover, the junction temperature of the packages decreases with increase in Reynolds Number.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages174-181
Number of pages8
Volume795
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2nd International Conference on Sustainable Materials, ICoSM 2013 - Penang
Duration: 26 Mar 201327 Mar 2013

Publication series

NameAdvanced Materials Research
Volume795
ISSN (Print)10226680

Other

Other2nd International Conference on Sustainable Materials, ICoSM 2013
CityPenang
Period26/3/1327/3/13

Fingerprint

Sheet molding compounds
Personal computers
Computational fluid dynamics
Plastics
Reynolds number
Temperature
Printed circuit boards
Wind tunnels
Numerical analysis
Flow of fluids
Heat transfer

Keywords

  • Computational Fluid Dynamic (CFD)
  • Epoxy Moulding Compound (EMC)
  • Package chip powers
  • Plastic Leaded Chip Carrier (PLCC)

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Mazlan, M., Rahim, A., Iqbal, M. A., Mustafa Al Bakri, A. M., Razak, W., & Mohd Sukhairi, M. R. (2013). The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC). In Advanced Materials Research (Vol. 795, pp. 174-181). (Advanced Materials Research; Vol. 795). https://doi.org/10.4028/www.scientific.net/AMR.795.174

The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC). / Mazlan, M.; Rahim, A.; Iqbal, M. A.; Mustafa Al Bakri, A. M.; Razak, W.; Mohd Sukhairi, M. R.

Advanced Materials Research. Vol. 795 2013. p. 174-181 (Advanced Materials Research; Vol. 795).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mazlan, M, Rahim, A, Iqbal, MA, Mustafa Al Bakri, AM, Razak, W & Mohd Sukhairi, MR 2013, The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC). in Advanced Materials Research. vol. 795, Advanced Materials Research, vol. 795, pp. 174-181, 2nd International Conference on Sustainable Materials, ICoSM 2013, Penang, 26/3/13. https://doi.org/10.4028/www.scientific.net/AMR.795.174
Mazlan M, Rahim A, Iqbal MA, Mustafa Al Bakri AM, Razak W, Mohd Sukhairi MR. The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC). In Advanced Materials Research. Vol. 795. 2013. p. 174-181. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.795.174
Mazlan, M. ; Rahim, A. ; Iqbal, M. A. ; Mustafa Al Bakri, A. M. ; Razak, W. ; Mohd Sukhairi, M. R. / The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC). Advanced Materials Research. Vol. 795 2013. pp. 174-181 (Advanced Materials Research).
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