Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach

Azman Jalar, Maria Abu Bakar, Roslina Ismail

Research output: Contribution to journalArticle

Abstract

This paper highlights the advantages of using the nanoindentation approach over the conventional method for the mechanical characterization of components used in electronic packaging. The limitation of the conventional method has become more critical with the miniaturization of electronic packages, giving inadequate information regarding the mechanical properties of metallurgical interconnections. The load–displacement approach via nanoindentation was used in this study to determine the micromechanical properties of a fine-pitch solder joint subjected to aging for 1000 hours. This approach is more advantageous than tensile testing, as it focuses on the elastic behavior unlike that in conventional mechanical testing. The nanoindentation analysis results showed that the elastic–plastic behavior before failure can be assessed in a wide range of temperatures and thus help study the temperature dependence on the mechanical properties of fine-pitch solder joints. The characterization was done beyond the elastic range beforehand of conventional method. The modulus and hardness of the fine-pitch SAC 0307 solder joint decreased while its plastic and elastic behaviors became pronounced at higher aging temperatures. This implies that solder joints become weaker and less resilient with increasing temperature, at least for a duration of 1000 hours.

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Nanoindentation
solders
nanoindentation
Soldering alloys
temperature dependence
Aging of materials
mechanical properties
electronic packaging
Mechanical properties
Temperature
Electronics packaging
Mechanical testing
Tensile testing
miniaturization
temperature
hardness
plastics
Hardness
Plastics
electronics

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

Cite this

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title = "Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach",
abstract = "This paper highlights the advantages of using the nanoindentation approach over the conventional method for the mechanical characterization of components used in electronic packaging. The limitation of the conventional method has become more critical with the miniaturization of electronic packages, giving inadequate information regarding the mechanical properties of metallurgical interconnections. The load–displacement approach via nanoindentation was used in this study to determine the micromechanical properties of a fine-pitch solder joint subjected to aging for 1000 hours. This approach is more advantageous than tensile testing, as it focuses on the elastic behavior unlike that in conventional mechanical testing. The nanoindentation analysis results showed that the elastic–plastic behavior before failure can be assessed in a wide range of temperatures and thus help study the temperature dependence on the mechanical properties of fine-pitch solder joints. The characterization was done beyond the elastic range beforehand of conventional method. The modulus and hardness of the fine-pitch SAC 0307 solder joint decreased while its plastic and elastic behaviors became pronounced at higher aging temperatures. This implies that solder joints become weaker and less resilient with increasing temperature, at least for a duration of 1000 hours.",
author = "Azman Jalar and Bakar, {Maria Abu} and Roslina Ismail",
year = "2020",
month = "1",
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doi = "10.1007/s11661-019-05614-1",
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journal = "Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science",
issn = "1073-5623",
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AU - Jalar, Azman

AU - Bakar, Maria Abu

AU - Ismail, Roslina

PY - 2020/1/1

Y1 - 2020/1/1

N2 - This paper highlights the advantages of using the nanoindentation approach over the conventional method for the mechanical characterization of components used in electronic packaging. The limitation of the conventional method has become more critical with the miniaturization of electronic packages, giving inadequate information regarding the mechanical properties of metallurgical interconnections. The load–displacement approach via nanoindentation was used in this study to determine the micromechanical properties of a fine-pitch solder joint subjected to aging for 1000 hours. This approach is more advantageous than tensile testing, as it focuses on the elastic behavior unlike that in conventional mechanical testing. The nanoindentation analysis results showed that the elastic–plastic behavior before failure can be assessed in a wide range of temperatures and thus help study the temperature dependence on the mechanical properties of fine-pitch solder joints. The characterization was done beyond the elastic range beforehand of conventional method. The modulus and hardness of the fine-pitch SAC 0307 solder joint decreased while its plastic and elastic behaviors became pronounced at higher aging temperatures. This implies that solder joints become weaker and less resilient with increasing temperature, at least for a duration of 1000 hours.

AB - This paper highlights the advantages of using the nanoindentation approach over the conventional method for the mechanical characterization of components used in electronic packaging. The limitation of the conventional method has become more critical with the miniaturization of electronic packages, giving inadequate information regarding the mechanical properties of metallurgical interconnections. The load–displacement approach via nanoindentation was used in this study to determine the micromechanical properties of a fine-pitch solder joint subjected to aging for 1000 hours. This approach is more advantageous than tensile testing, as it focuses on the elastic behavior unlike that in conventional mechanical testing. The nanoindentation analysis results showed that the elastic–plastic behavior before failure can be assessed in a wide range of temperatures and thus help study the temperature dependence on the mechanical properties of fine-pitch solder joints. The characterization was done beyond the elastic range beforehand of conventional method. The modulus and hardness of the fine-pitch SAC 0307 solder joint decreased while its plastic and elastic behaviors became pronounced at higher aging temperatures. This implies that solder joints become weaker and less resilient with increasing temperature, at least for a duration of 1000 hours.

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