Synthesizing SnAgCu nanoparticles by electrodeposition of reverse microemulsion electrolyte

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Solder printing faces challenges in print definition and sustainable volume transfer as the microelectronic industry migrates to smaller footprints. Nano-sized alloy particles mitigate these issues by modifying the solder formulation and rheology. We propose an electrodeposition method using reverse microemulsion (without reducing agent) as electrolyte to synthesize Sn-Ag-Cu solder alloy nanoparticle. SnCl2.2H2O, Ag2SO4 and CuSO4 are used as the precursor. N-hexane, TritonX-100 and n-hexanol are used as oil phase, surfactant and co-surfactant, respectively. Three volume ratios of aqueous to surfactant phase, Wo are carried out namely: 0.20, 0.40 and 0.60 but only the ratio of 4.5:1.0 is able to synthesize the nano-sized SAC particles. Scanning electron microscopy shows the spherical SAC particles are well dispersed and their sizes range from 15 to 90 nm. X-ray diffraction spectra show the formation of Sn, Ag3Sn and Cu6Sn5 without any oxide peaks in the synthesized nanoparticles; their absence suggests the effectiveness of the surfactants in protecting the alloy particles from oxidation. This electrodeposition method compares favourably to the microemulsion (with reducing agent) method in producing spherical and well-distributed nanosized solder particles.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages513-516
Number of pages4
ISBN (Print)9781479957606
DOIs
Publication statusPublished - 10 Oct 2014
Event11th IEEE International Conference on Semiconductor Electronics, ICSE 2014 - Kuala Lumpur
Duration: 27 Aug 201429 Aug 2014

Other

Other11th IEEE International Conference on Semiconductor Electronics, ICSE 2014
CityKuala Lumpur
Period27/8/1429/8/14

Fingerprint

Microemulsions
Electrodeposition
Surface-Active Agents
Soldering alloys
Electrolytes
Surface active agents
Nanoparticles
Reducing Agents
Reducing agents
Hexanes
Hexane
Rheology
Microelectronics
Oxides
Printing
Oils
X ray diffraction
Oxidation
Scanning electron microscopy
Industry

Keywords

  • electrodeposition
  • reverse microemulson
  • SAC
  • SnAgCu nanoparticle

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Foo, S. P., Siow, K. S., & Jalar @ Jalil, A. (2014). Synthesizing SnAgCu nanoparticles by electrodeposition of reverse microemulsion electrolyte. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 513-516). [6920911] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SMELEC.2014.6920911

Synthesizing SnAgCu nanoparticles by electrodeposition of reverse microemulsion electrolyte. / Foo, S. P.; Siow, Kim Shyong; Jalar @ Jalil, Azman.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc., 2014. p. 513-516 6920911.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Foo, SP, Siow, KS & Jalar @ Jalil, A 2014, Synthesizing SnAgCu nanoparticles by electrodeposition of reverse microemulsion electrolyte. in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 6920911, Institute of Electrical and Electronics Engineers Inc., pp. 513-516, 11th IEEE International Conference on Semiconductor Electronics, ICSE 2014, Kuala Lumpur, 27/8/14. https://doi.org/10.1109/SMELEC.2014.6920911
Foo SP, Siow KS, Jalar @ Jalil A. Synthesizing SnAgCu nanoparticles by electrodeposition of reverse microemulsion electrolyte. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc. 2014. p. 513-516. 6920911 https://doi.org/10.1109/SMELEC.2014.6920911
Foo, S. P. ; Siow, Kim Shyong ; Jalar @ Jalil, Azman. / Synthesizing SnAgCu nanoparticles by electrodeposition of reverse microemulsion electrolyte. IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 513-516
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