Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package

Lai Chin Yung, Cheong Choke Fei, Mandeep Singh Jit Singh, Huda Abdullah, Lai Khin Wee

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio frequency identification (RFID) and light emitting diode (LED) industries, with limited usage in semiconductor packaging. The use of printed ink in semiconductor IC packaging is limited by several factors such as poor electrical performance and mechanical strength. Poor adhesion of the printed metal track to the epoxy molding compound is another critical factor that has caused a decline in interest in the application of printing technology to the semiconductor industry. In this study, two different groups of adhesion promoters, based on metal and polymer groups, were used to promote adhesion between the printed ink and the epoxy molding substrate. The experimental data show that silver ink with a metal oxide adhesion promoter adheres better than silver ink with a polymer adhesion promoter. This result can be explained by the hydroxyl bonding between the metal oxide promoter and the silane grouping agent on the epoxy substrate, which contributes a greater adhesion strength compared to the polymer adhesion promoter. Hypotheses of the physical and chemical functions of both adhesion promoters are described in detail.

Original languageEnglish
Article numbere97484
JournalPLoS One
Volume9
Issue number5
DOIs
Publication statusPublished - 15 May 2014

Fingerprint

semiconductors
Ink
Semiconductors
Conductive films
Silver
Thick films
films (materials)
silver
adhesion
Adhesion
Metals
metals
Semiconductor materials
Fabrication
Printing
synthesis
Industry
Polymers
epoxides
Product Packaging

ASJC Scopus subject areas

  • Agricultural and Biological Sciences(all)
  • Biochemistry, Genetics and Molecular Biology(all)
  • Medicine(all)

Cite this

Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package. / Yung, Lai Chin; Fei, Cheong Choke; Jit Singh, Mandeep Singh; Abdullah, Huda; Wee, Lai Khin.

In: PLoS One, Vol. 9, No. 5, e97484, 15.05.2014.

Research output: Contribution to journalArticle

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