Surface roughness and wettability of SAC/CNT lead free solder

Norliza Ismail, Roslina Ismail, Nik Khairul Amilin Nik Ubaidillah, Azman Jalar @ Jalil, Norazwani Muhammad Zain

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The effect of substrate surface roughness on the wettability of SAC237 (Sn 99.9%, Ag 0.3%, Cu 0.7%) with difference percentage of CNT on copper substrate was investigated. Solder paste of SAC 237 without CNT, 0.01% and 0.04% of CNT were reflowed at 270°C on different surface roughness of Cu substrate (abrasive number 240, 400, 600, 800). Contact angle of soldered samples measured by Infinite Focus Microscope (IFM). As a result, contact angle value of investigated solders range 7° to 20°. Contact angle obtained decreases with the increasing surface roughness of Cu substrate. This demonstrates that rougher substrate enhance the wettability of the solders. Addition of CNT also effects the wettability of investigated solders. Higher composition of CNT show better wettability.

Original languageEnglish
Title of host publicationMaterials Science Forum
PublisherTrans Tech Publications Ltd
Pages73-75
Number of pages3
Volume857
ISBN (Print)9783035710205
DOIs
Publication statusPublished - 2016
EventInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China
Duration: 4 Dec 20155 Dec 2015

Publication series

NameMaterials Science Forum
Volume857
ISSN (Print)02555476

Other

OtherInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015
CountryTaiwan, Province of China
CityKaohsiung
Period4/12/155/12/15

Fingerprint

solders
wettability
Wetting
surface roughness
Surface roughness
Soldering alloys
carbon nanotubes
Contact angle
Substrates
abrasives
Ointments
Abrasives
Copper
Microscopes
microscopes
Lead-free solders
copper
Chemical analysis

Keywords

  • Carbon nanotube
  • Contact angle
  • Roughness
  • Sn-Ag-Cu
  • Wettability

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Ismail, N., Ismail, R., Nik Ubaidillah, N. K. A., Jalar @ Jalil, A., & Zain, N. M. (2016). Surface roughness and wettability of SAC/CNT lead free solder. In Materials Science Forum (Vol. 857, pp. 73-75). (Materials Science Forum; Vol. 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.73

Surface roughness and wettability of SAC/CNT lead free solder. / Ismail, Norliza; Ismail, Roslina; Nik Ubaidillah, Nik Khairul Amilin; Jalar @ Jalil, Azman; Zain, Norazwani Muhammad.

Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. p. 73-75 (Materials Science Forum; Vol. 857).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ismail, N, Ismail, R, Nik Ubaidillah, NKA, Jalar @ Jalil, A & Zain, NM 2016, Surface roughness and wettability of SAC/CNT lead free solder. in Materials Science Forum. vol. 857, Materials Science Forum, vol. 857, Trans Tech Publications Ltd, pp. 73-75, International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, Province of China, 4/12/15. https://doi.org/10.4028/www.scientific.net/MSF.857.73
Ismail N, Ismail R, Nik Ubaidillah NKA, Jalar @ Jalil A, Zain NM. Surface roughness and wettability of SAC/CNT lead free solder. In Materials Science Forum. Vol. 857. Trans Tech Publications Ltd. 2016. p. 73-75. (Materials Science Forum). https://doi.org/10.4028/www.scientific.net/MSF.857.73
Ismail, Norliza ; Ismail, Roslina ; Nik Ubaidillah, Nik Khairul Amilin ; Jalar @ Jalil, Azman ; Zain, Norazwani Muhammad. / Surface roughness and wettability of SAC/CNT lead free solder. Materials Science Forum. Vol. 857 Trans Tech Publications Ltd, 2016. pp. 73-75 (Materials Science Forum).
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abstract = "The effect of substrate surface roughness on the wettability of SAC237 (Sn 99.9{\%}, Ag 0.3{\%}, Cu 0.7{\%}) with difference percentage of CNT on copper substrate was investigated. Solder paste of SAC 237 without CNT, 0.01{\%} and 0.04{\%} of CNT were reflowed at 270°C on different surface roughness of Cu substrate (abrasive number 240, 400, 600, 800). Contact angle of soldered samples measured by Infinite Focus Microscope (IFM). As a result, contact angle value of investigated solders range 7° to 20°. Contact angle obtained decreases with the increasing surface roughness of Cu substrate. This demonstrates that rougher substrate enhance the wettability of the solders. Addition of CNT also effects the wettability of investigated solders. Higher composition of CNT show better wettability.",
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