Structure design and fabrication of an area-changed bulk micromachined capacitive accelerometer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

In this paper, a lateral capacitive MEMS accelerometer for low-g applications was designed and fabricated. The accelerometer is chosen to be based on an area-changed detection scheme. Area-changed accelerometer s can provide alternatives in designing high sensitivity and low mechanical noise floor sensors as it is capable of providing a large proof mass. Based on the calculation of sensitivity and basic resonance frequency, three kinds of accelerometers were designed and optimized. Bulk silicon is chosen as the proof mass material and a three-mask micromachining technology was adopted to fabricate the active structures of the accelerometer. Deep RIE and wafer bonding techniques are utilized as it offers solutions in fabricating the thick proof mass and high aspect ratio sensing element structures with small sensing gaps to achieve high sensitivity and low noise performance.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
Pages29-34
Number of pages6
DOIs
Publication statusPublished - 2006
Event2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006 - Kuala Lumpur
Duration: 29 Nov 20061 Dec 2006

Other

Other2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006
CityKuala Lumpur
Period29/11/061/12/06

Fingerprint

Accelerometers
Fabrication
Wafer bonding
Reactive ion etching
Micromachining
MEMS
Aspect ratio
Masks
Silicon
Sensors

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Bais, B., & Yeop Majlis, B. (2006). Structure design and fabrication of an area-changed bulk micromachined capacitive accelerometer. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 29-34). [4266564] https://doi.org/10.1109/SMELEC.2006.381014

Structure design and fabrication of an area-changed bulk micromachined capacitive accelerometer. / Bais, Badariah; Yeop Majlis, Burhanuddin.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2006. p. 29-34 4266564.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bais, B & Yeop Majlis, B 2006, Structure design and fabrication of an area-changed bulk micromachined capacitive accelerometer. in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 4266564, pp. 29-34, 2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006, Kuala Lumpur, 29/11/06. https://doi.org/10.1109/SMELEC.2006.381014
Bais B, Yeop Majlis B. Structure design and fabrication of an area-changed bulk micromachined capacitive accelerometer. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2006. p. 29-34. 4266564 https://doi.org/10.1109/SMELEC.2006.381014
Bais, Badariah ; Yeop Majlis, Burhanuddin. / Structure design and fabrication of an area-changed bulk micromachined capacitive accelerometer. IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2006. pp. 29-34
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