Structural durability of QFN package using three-point bending test

M. F M Yunoh, Shahrir Abdullah, Azman Jalar @ Jalil, M. F. Abdullah, Rozli Zulkifli

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

This paper presents the effects of stress and applied load on the hardness of an Epoxy Mold Compound (EMC) of a Quad Flat No-Lead (QFN) package. This work was carried out using three-points bending flexural with quasi-static loading test by means of simulation and experiments, three-points bending cyclic test, and nanoindentation technique on an EMC of a QFN package. Five different loads in the range of 30 to 150 N were applied in all tests. All loadings were imposed on the center of the QFN package during the test. A strain gauge was connected to the fatigue data acquisition system that was used for each tested QFN package to determine the response of the captured cyclic strain signal. The nanoindentation a maximum load of 300 mN, was indented at five locations that were perpendicular to the stress line on the EMC of the QFN package after a three-points bending cyclic test was performed. The findings showed that the stress value of the QFN package using simulation and experiment varied with load. The calculated percentage error between the stress of the simulation and the experimental was smaller, which was less than 10%. The constant amplitude pattern of strain signal response was obtained from the cyclic test. This study also indicated a linear relationship between stress and hardness range by means of a coefficient correlation (R 2) at 87% and also a linear relationship between strain signal amplitude and hardness range with a coefficient correlation (R 2) at 60%. This paper investigates the structure of the QFN package to improve the reliability and the durability of the package when exposed to cyclic bending.

Original languageEnglish
Pages (from-to)528-536
Number of pages9
JournalInternational Review of Mechanical Engineering
Volume6
Issue number3
Publication statusPublished - 2012

Fingerprint

Bending tests
Durability
Lead
Loads (forces)
Hardness
Nanoindentation
Strain gages
Data acquisition
Experiments
Fatigue of materials

Keywords

  • Hardness
  • Load
  • QFN
  • Simulation
  • Stress

ASJC Scopus subject areas

  • Mechanical Engineering

Cite this

Structural durability of QFN package using three-point bending test. / Yunoh, M. F M; Abdullah, Shahrir; Jalar @ Jalil, Azman; Abdullah, M. F.; Zulkifli, Rozli.

In: International Review of Mechanical Engineering, Vol. 6, No. 3, 2012, p. 528-536.

Research output: Contribution to journalArticle

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