Structural assessment of lead free solder joint of miniaturized electronics assembly

Zuraihana Bachok, Abdullah Aziz Saad, Fakhrozi Che Ani, Azman Jalar @ Jalil, Mohamad Aizat Abas

Research output: Contribution to journalArticle

Abstract

This paper presents a study on structural assessment of ultra-fine package assembly with nanocomposites lead free solder joint after reflow soldering process. In this work, various nanoparticles (i.e. TiO 2 , Fe 2 O 3 and NiO) with different weight percentage (i.e., 0.01, 0.05 and 0.15 wt.%) were successfully incorporated into SAC305 solder paste using a mechanical solder paste mixer to synthesize novel lead-free composite solders. Effects of the nanoparticles addition on quality of joining and fillet height between various weightage (wt.%) for the ultra-fine package assembly in the reflow soldering process have been investigated by using a scanning electron microscope (SEM) system equipped with an energy dispersive X-ray spectroscopy (EDS) and XTV 160 xray inspection system. Experimental results show the addition of TiO 2 , Fe 2 O 3 and NiO nanoparticles with 0.15wt.%, 0.05wt.% and 0.01wt.%, respectively, produce the best fillet height of each composition of nanoparticles solder paste. Among all these new composition of nanoparticles solder paste, NiO nanoparticles reinforced solder paste with 0.01wt.% yielded the highest fillet height. The miniaturized solder joints do not cause any problem in terms of solder voids. The findings show the capability of the reflow soldering process in assembling miniaturized electronics assembly and expected to provide a reference in electronic package industry.

Original languageEnglish
Pages (from-to)26-31
Number of pages6
JournalInternational Journal of Integrated Engineering
Volume10
Issue number5
DOIs
Publication statusPublished - 1 Jan 2018

Fingerprint

Soldering alloys
Electronic equipment
Ointments
Nanoparticles
Soldering
Adhesive pastes
Lead-free solders
Chemical analysis
Joining
Energy dispersive spectroscopy
Nanocomposites
Electron microscopes
Lead
Inspection
Scanning
Composite materials
Industry

Keywords

  • Composite solder
  • Ferum oxide (Fe O ) nanoparticle
  • Nickel oxide (NiO) nanoparticle
  • SAC305
  • Titanium dioxide (TiO ) nanoparticle
  • Ultra-fine package

ASJC Scopus subject areas

  • Civil and Structural Engineering
  • Materials Science (miscellaneous)
  • Mechanics of Materials
  • Mechanical Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Structural assessment of lead free solder joint of miniaturized electronics assembly. / Bachok, Zuraihana; Saad, Abdullah Aziz; Ani, Fakhrozi Che; Jalar @ Jalil, Azman; Abas, Mohamad Aizat.

In: International Journal of Integrated Engineering, Vol. 10, No. 5, 01.01.2018, p. 26-31.

Research output: Contribution to journalArticle

Bachok, Zuraihana ; Saad, Abdullah Aziz ; Ani, Fakhrozi Che ; Jalar @ Jalil, Azman ; Abas, Mohamad Aizat. / Structural assessment of lead free solder joint of miniaturized electronics assembly. In: International Journal of Integrated Engineering. 2018 ; Vol. 10, No. 5. pp. 26-31.
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