Stress distribution effect on a stacked-die QFN package manufacturing processes

I. Abdullah, Azman Jalar @ Jalil, Shahrum Abdullah, M. F. Rosle, M. F. Mod Yunoh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In the last decade, failure of microelectronic devices has become a prominent field of research all across the world. The results of this of failure analysis allow an engineer to choose package geometries and materials which reduce the risk of failure. This paper is meant to relate the stress effect on material properties during Quad Flat No-Leads (QFN) stacked-die packages manufacturing processes. To achieve the study, the finite element technique was used to perform an extensive structural analysis on a QFN package design once it was verified by related experiments. A QFN unit was developed in three dimensional geometry with various materials be will simulated in order to determine the location of failure. The induced stress results were also measured in the maximum value, indicating the low modulus and coefficient of thermal expansion (CTE) in the packaging material were important for reducing high stress during the manufacturing stages. However, numerical simulation demonstrated that the stress developments increased exponentially when the die attach temperature increased. Therefore, the induced stress can be relieved by having high die attach process temperature with an adequate bonding force and time. It was vital to control the induced stress in package materials during die attachment process for ensuring the reliability level of QFN packages.

Original languageEnglish
Title of host publicationKey Engineering Materials
Pages1273-1278
Number of pages6
Volume462-463
DOIs
Publication statusPublished - 2011
Event8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010 - Kuala Lumpur
Duration: 7 Jun 20109 Jun 2010

Publication series

NameKey Engineering Materials
Volume462-463
ISSN (Print)10139826

Other

Other8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010
CityKuala Lumpur
Period7/6/109/6/10

Fingerprint

Stress concentration
Lead
Packaging materials
Geometry
Structural analysis
Microelectronics
Failure analysis
Thermal expansion
Elvitegravir, Cobicistat, Emtricitabine, Tenofovir Disoproxil Fumarate Drug Combination
Materials properties
Engineers
Temperature
Computer simulation
Experiments

Keywords

  • Coefficient of thermal expansion
  • Finite element
  • QFN packages
  • Stress

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Abdullah, I., Jalar @ Jalil, A., Abdullah, S., Rosle, M. F., & Mod Yunoh, M. F. (2011). Stress distribution effect on a stacked-die QFN package manufacturing processes. In Key Engineering Materials (Vol. 462-463, pp. 1273-1278). (Key Engineering Materials; Vol. 462-463). https://doi.org/10.4028/www.scientific.net/KEM.462-463.1273

Stress distribution effect on a stacked-die QFN package manufacturing processes. / Abdullah, I.; Jalar @ Jalil, Azman; Abdullah, Shahrum; Rosle, M. F.; Mod Yunoh, M. F.

Key Engineering Materials. Vol. 462-463 2011. p. 1273-1278 (Key Engineering Materials; Vol. 462-463).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abdullah, I, Jalar @ Jalil, A, Abdullah, S, Rosle, MF & Mod Yunoh, MF 2011, Stress distribution effect on a stacked-die QFN package manufacturing processes. in Key Engineering Materials. vol. 462-463, Key Engineering Materials, vol. 462-463, pp. 1273-1278, 8th International Conference on Fracture and Strength of Solids 2010, FEOFS2010, Kuala Lumpur, 7/6/10. https://doi.org/10.4028/www.scientific.net/KEM.462-463.1273
Abdullah I, Jalar @ Jalil A, Abdullah S, Rosle MF, Mod Yunoh MF. Stress distribution effect on a stacked-die QFN package manufacturing processes. In Key Engineering Materials. Vol. 462-463. 2011. p. 1273-1278. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.462-463.1273
Abdullah, I. ; Jalar @ Jalil, Azman ; Abdullah, Shahrum ; Rosle, M. F. ; Mod Yunoh, M. F. / Stress distribution effect on a stacked-die QFN package manufacturing processes. Key Engineering Materials. Vol. 462-463 2011. pp. 1273-1278 (Key Engineering Materials).
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