Strength distribution of Au ball bond using nanoindentation approach

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6 Citations (Scopus)

Abstract

The evaluation of gold, Au ball bond requires a new approach to obtain a more localized and detailed result. This is due to the limited data in terms of quality and quantity obtained from conventional tests. The nanoindentation test is proposed in order to evaluate the quality of ball bond in more detail. The nanoindentation test was carried out to analyze the strengthening of Au ball bond after being subjected to high temperature storage, HTS. It was observed that Au and intermetallic compounds, IMC, have a higher creep behavior compared to that of silicon, Si. The dislocation glide was the responsible indentation creep mechanism for Au and IMC of ball bond that have been subjected to 0 and 1000. h of HTS. It was observed that the variation of creep behavior of Au ball bond was reduced after being subjected to 1000. h of HTS. The variation of creep behavior of IMC decreased after being subjected to 1000. h of HTS. It was also noted that the creep behavior of both Au and IMC decreased with the increase of HTS time interval. It was found that the hardness value for Au decreased with the increase of HTS time interval, whereas, the hardness value of IMC increased with the increment of HTS time interval. Based on the results obtained, it was indicated that the nanoindentation test has the ability to evaluate the strengthening of Au ball bond in a localized manner and in more detail compared to that of the conventional tests.

Original languageEnglish
Pages (from-to)189-196
Number of pages8
JournalMaterials Science and Engineering A
Volume577
DOIs
Publication statusPublished - 10 Aug 2013

Fingerprint

Nanoindentation
nanoindentation
balls
Creep
intervals
Hardness
hardness
Silicon
Indentation
Gold
Intermetallics
indentation
intermetallics
gold
evaluation
silicon
Temperature

Keywords

  • Au ball bond
  • Creep
  • High temperature storage
  • Nanoindentation
  • Strengthening

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

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title = "Strength distribution of Au ball bond using nanoindentation approach",
abstract = "The evaluation of gold, Au ball bond requires a new approach to obtain a more localized and detailed result. This is due to the limited data in terms of quality and quantity obtained from conventional tests. The nanoindentation test is proposed in order to evaluate the quality of ball bond in more detail. The nanoindentation test was carried out to analyze the strengthening of Au ball bond after being subjected to high temperature storage, HTS. It was observed that Au and intermetallic compounds, IMC, have a higher creep behavior compared to that of silicon, Si. The dislocation glide was the responsible indentation creep mechanism for Au and IMC of ball bond that have been subjected to 0 and 1000. h of HTS. It was observed that the variation of creep behavior of Au ball bond was reduced after being subjected to 1000. h of HTS. The variation of creep behavior of IMC decreased after being subjected to 1000. h of HTS. It was also noted that the creep behavior of both Au and IMC decreased with the increase of HTS time interval. It was found that the hardness value for Au decreased with the increase of HTS time interval, whereas, the hardness value of IMC increased with the increment of HTS time interval. Based on the results obtained, it was indicated that the nanoindentation test has the ability to evaluate the strengthening of Au ball bond in a localized manner and in more detail compared to that of the conventional tests.",
keywords = "Au ball bond, Creep, High temperature storage, Nanoindentation, Strengthening",
author = "Zulkifli, {Muhammad Nubli} and {Jalar @ Jalil}, Azman and Shahrum Abdullah and {Abdul Rahman}, Irman and {Abdul Hamid}, {Muhammad Azmi}",
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AU - Abdul Hamid, Muhammad Azmi

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N2 - The evaluation of gold, Au ball bond requires a new approach to obtain a more localized and detailed result. This is due to the limited data in terms of quality and quantity obtained from conventional tests. The nanoindentation test is proposed in order to evaluate the quality of ball bond in more detail. The nanoindentation test was carried out to analyze the strengthening of Au ball bond after being subjected to high temperature storage, HTS. It was observed that Au and intermetallic compounds, IMC, have a higher creep behavior compared to that of silicon, Si. The dislocation glide was the responsible indentation creep mechanism for Au and IMC of ball bond that have been subjected to 0 and 1000. h of HTS. It was observed that the variation of creep behavior of Au ball bond was reduced after being subjected to 1000. h of HTS. The variation of creep behavior of IMC decreased after being subjected to 1000. h of HTS. It was also noted that the creep behavior of both Au and IMC decreased with the increase of HTS time interval. It was found that the hardness value for Au decreased with the increase of HTS time interval, whereas, the hardness value of IMC increased with the increment of HTS time interval. Based on the results obtained, it was indicated that the nanoindentation test has the ability to evaluate the strengthening of Au ball bond in a localized manner and in more detail compared to that of the conventional tests.

AB - The evaluation of gold, Au ball bond requires a new approach to obtain a more localized and detailed result. This is due to the limited data in terms of quality and quantity obtained from conventional tests. The nanoindentation test is proposed in order to evaluate the quality of ball bond in more detail. The nanoindentation test was carried out to analyze the strengthening of Au ball bond after being subjected to high temperature storage, HTS. It was observed that Au and intermetallic compounds, IMC, have a higher creep behavior compared to that of silicon, Si. The dislocation glide was the responsible indentation creep mechanism for Au and IMC of ball bond that have been subjected to 0 and 1000. h of HTS. It was observed that the variation of creep behavior of Au ball bond was reduced after being subjected to 1000. h of HTS. The variation of creep behavior of IMC decreased after being subjected to 1000. h of HTS. It was also noted that the creep behavior of both Au and IMC decreased with the increase of HTS time interval. It was found that the hardness value for Au decreased with the increase of HTS time interval, whereas, the hardness value of IMC increased with the increment of HTS time interval. Based on the results obtained, it was indicated that the nanoindentation test has the ability to evaluate the strengthening of Au ball bond in a localized manner and in more detail compared to that of the conventional tests.

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