Strain rate effect on micromechanical properties of SnAgCu solder wire

I. Abdullah, R. Ismail, Azman Jalar @ Jalil

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Dislocation behavior was occurs when an eutectic solder alloy of SnAgCu experiencing different strain at room temperature that require the further analysis in order to relate the physical and microstructure changes towards the mechanical performance of lead free solder. In this study, nanoindentation technique was applied to determine the hardness and modulus on six variant of strain (0.00015 mms-1, 0.0015 mms-1, 0.015 mms-1, 0.15 mms-1, 1.5 mms-1 and 15 mms-1) after tensile test. The P-h curves and the micromechanical parameter namely hardness and residual modulus through nanoindentation test were conducted. The analysis were obtained strain rate sensitivity (m) and stress exponent (n) from dwell time in order to determine the mechanism of grains. The P-h curve result showed the pop-in event at the ranges of 100 nm to 300 nm. The micromechanical properties were show the increment of values at high strain rates. The dominated discontinuity local will occurrence the pop-in event and will activating dislocation distribution.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages343-346
Number of pages4
ISBN (Print)9781479957606
DOIs
Publication statusPublished - 10 Oct 2014
Event11th IEEE International Conference on Semiconductor Electronics, ICSE 2014 - Kuala Lumpur
Duration: 27 Aug 201429 Aug 2014

Other

Other11th IEEE International Conference on Semiconductor Electronics, ICSE 2014
CityKuala Lumpur
Period27/8/1429/8/14

Fingerprint

Nanoindentation
Soldering alloys
Strain rate
Hardness
Wire
Dislocations (crystals)
Eutectics
Microstructure
Temperature
Lead-free solders

Keywords

  • dislocation
  • nanoindentation
  • P-h curve
  • pop-in event
  • SnAgCu
  • strain rate

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Abdullah, I., Ismail, R., & Jalar @ Jalil, A. (2014). Strain rate effect on micromechanical properties of SnAgCu solder wire. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 343-346). [6920868] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SMELEC.2014.6920868

Strain rate effect on micromechanical properties of SnAgCu solder wire. / Abdullah, I.; Ismail, R.; Jalar @ Jalil, Azman.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc., 2014. p. 343-346 6920868.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abdullah, I, Ismail, R & Jalar @ Jalil, A 2014, Strain rate effect on micromechanical properties of SnAgCu solder wire. in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 6920868, Institute of Electrical and Electronics Engineers Inc., pp. 343-346, 11th IEEE International Conference on Semiconductor Electronics, ICSE 2014, Kuala Lumpur, 27/8/14. https://doi.org/10.1109/SMELEC.2014.6920868
Abdullah I, Ismail R, Jalar @ Jalil A. Strain rate effect on micromechanical properties of SnAgCu solder wire. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc. 2014. p. 343-346. 6920868 https://doi.org/10.1109/SMELEC.2014.6920868
Abdullah, I. ; Ismail, R. ; Jalar @ Jalil, Azman. / Strain rate effect on micromechanical properties of SnAgCu solder wire. IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 343-346
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