Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top

Muhamad Mat Salleh, Ibrahim Ahmad, Azman Jalar @ Jalil, Ghazali Omar, Siti Hajar Abdullah, Mohd Khairuddin Arshad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper will be discussed some aspects of surface morphology and elemental analysis on the solderability problem which caused non-wetting on top of die metallization layer. In this study few good and bad fresh die will be investigated along with the bad die which have non-wetting at die top. The surface analysis techniques will be used such as optical microscope and SEM to observe surface morphology. EDX investigation being done to determine the elements presents on the samples surface. Further details information using FIB also been performed. Contact angle analysis to measure the surface tension onto related area and FTIR analysis as support techniques.

Original languageEnglish
Title of host publicationProceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics
Pages650-655
Number of pages6
Publication statusPublished - 2004
Event2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004 - Kuala Lumpur
Duration: 4 Dec 20049 Dec 2004

Other

Other2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004
CityKuala Lumpur
Period4/12/049/12/04

Fingerprint

Surface morphology
Chemical analysis
Surface analysis
Metallizing
Contact angle
Surface tension
Energy dispersive spectroscopy
Microscopes
Scanning electron microscopy

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Mat Salleh, M., Ahmad, I., Jalar @ Jalil, A., Omar, G., Abdullah, S. H., & Arshad, M. K. (2004). Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top. In Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics (pp. 650-655). [1620970]

Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top. / Mat Salleh, Muhamad; Ahmad, Ibrahim; Jalar @ Jalil, Azman; Omar, Ghazali; Abdullah, Siti Hajar; Arshad, Mohd Khairuddin.

Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. p. 650-655 1620970.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mat Salleh, M, Ahmad, I, Jalar @ Jalil, A, Omar, G, Abdullah, SH & Arshad, MK 2004, Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top. in Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics., 1620970, pp. 650-655, 2004 IEEE International Conference on Semiconductor Electronics, ICSE 2004, Kuala Lumpur, 4/12/04.
Mat Salleh M, Ahmad I, Jalar @ Jalil A, Omar G, Abdullah SH, Arshad MK. Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top. In Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. p. 650-655. 1620970
Mat Salleh, Muhamad ; Ahmad, Ibrahim ; Jalar @ Jalil, Azman ; Omar, Ghazali ; Abdullah, Siti Hajar ; Arshad, Mohd Khairuddin. / Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top. Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics. 2004. pp. 650-655
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