Solder joint strength of lead free solders under multiple reflow and high temperature storage condition

Ibrahim Ahmad, Azman Jalar @ Jalil, Burhanuddin Yeop Majlis, Eu Poh Leng, Yong Soo San

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Solder Joining is one of the interconnection methods in microelectronic packaging. The robustness of the solder ball attachment to the packages determines the solder joint strength between solders and the Under-Bump Metallization (UBM). This paper discussed the solder joint shear strength between Sn/4.0/0.5Cu with containing 20-50 ppm Phosporus and Sn/3.8Ag/0.7Cu deposited onto selective plating Ni/Au surface finish TBGA packages. Both were reflowed at a peak reflow temperature of 245±5°C with soaking time 70 second above 220°C. Ball shear testing along with failure mode analysis is used as a destructive method to assess solder joint strength and integrity. Both Sn -Ag-Cu (SAC) were studied under multiple reflow (1×, 2×, 3×, 6×) and high temperature storage (HTS) test at 24, 48, 96 hours. All samples were cross-sectioned to study the IMC thickness that leads to solder joint embrittlement. As a result, Sn/3.8Ag/0.7Cu performs better shear strength after HTS test than Sn/4.0/0.5Cu. Similarly, both show the decreasing of shear strength with increasing number of reflow cycles, supported by IMC thickness measurement that there is no significant different in term of growth and consistency.

Original languageEnglish
Title of host publicationIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
Pages541-544
Number of pages4
DOIs
Publication statusPublished - 2006
Event2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006 - Kuala Lumpur
Duration: 29 Nov 20061 Dec 2006

Other

Other2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006
CityKuala Lumpur
Period29/11/061/12/06

Fingerprint

Soldering alloys
Shear strength
Temperature
Thickness measurement
Embrittlement
Metallizing
Lead-free solders
Plating
Microelectronics
Joining
Failure modes
Packaging
Testing

Keywords

  • High temperature storage (HTS)
  • Intermetallic Compound (IMC)
  • Shear strength
  • Solder joint
  • Under Bump Metallurgy (UBM)

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Ahmad, I., Jalar @ Jalil, A., Yeop Majlis, B., Leng, E. P., & San, Y. S. (2006). Solder joint strength of lead free solders under multiple reflow and high temperature storage condition. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE (pp. 541-544). [4266672] https://doi.org/10.1109/SMELEC.2006.380689

Solder joint strength of lead free solders under multiple reflow and high temperature storage condition. / Ahmad, Ibrahim; Jalar @ Jalil, Azman; Yeop Majlis, Burhanuddin; Leng, Eu Poh; San, Yong Soo.

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2006. p. 541-544 4266672.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ahmad, I, Jalar @ Jalil, A, Yeop Majlis, B, Leng, EP & San, YS 2006, Solder joint strength of lead free solders under multiple reflow and high temperature storage condition. in IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE., 4266672, pp. 541-544, 2006 IEEE International Conference on Semiconductor Electronics, ICSE 2006, Kuala Lumpur, 29/11/06. https://doi.org/10.1109/SMELEC.2006.380689
Ahmad I, Jalar @ Jalil A, Yeop Majlis B, Leng EP, San YS. Solder joint strength of lead free solders under multiple reflow and high temperature storage condition. In IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2006. p. 541-544. 4266672 https://doi.org/10.1109/SMELEC.2006.380689
Ahmad, Ibrahim ; Jalar @ Jalil, Azman ; Yeop Majlis, Burhanuddin ; Leng, Eu Poh ; San, Yong Soo. / Solder joint strength of lead free solders under multiple reflow and high temperature storage condition. IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE. 2006. pp. 541-544
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