Sn-rich phase coarsening in Sn-Ag-Cu solder joint during moderate current stressing

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The changes of microstructure in eutectic sn-3.8ag-0.7cu during moderate current stressing have been investigated. The current stressing values were 102 and 103 a/cm2. The tests were carried out for 24, 216, 576 and 1008 hours. Sn-rich phases and eutectic phases appear immediately after soldering process. However, thermal rise during current stressing has coarsened sn-rich phases and altered the microstructure of the solder. Higher current density leads to larger snrich phase coarsening. The microstructures for current stressing test were also compared with the series of microstructure for isothermal annealing test since there is similarity in coarsening effect for both tests. The effect of thermal rising during current stressing as well as during isothermal annealing to sn-rich phase coarsening is established and will be discussed further.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages212-216
Number of pages5
Volume264-265
DOIs
Publication statusPublished - 2011
EventInternational Conference on Advances in Materials and Processing Technologies, AMPT 2009 -
Duration: 26 Oct 200929 Oct 2009

Publication series

NameAdvanced Materials Research
Volume264-265
ISSN (Print)10226680

Other

OtherInternational Conference on Advances in Materials and Processing Technologies, AMPT 2009
Period26/10/0929/10/09

Fingerprint

Coarsening
Soldering alloys
Isothermal annealing
Microstructure
Eutectics
Soldering
Current density
Hot Temperature

Keywords

  • Annealing
  • Current stressing
  • Sn-Ag-Cu
  • Sn-rich phase

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Saud, N., & Jalar @ Jalil, A. (2011). Sn-rich phase coarsening in Sn-Ag-Cu solder joint during moderate current stressing. In Advanced Materials Research (Vol. 264-265, pp. 212-216). (Advanced Materials Research; Vol. 264-265). https://doi.org/10.4028/www.scientific.net/AMR.264-265.212

Sn-rich phase coarsening in Sn-Ag-Cu solder joint during moderate current stressing. / Saud, N.; Jalar @ Jalil, Azman.

Advanced Materials Research. Vol. 264-265 2011. p. 212-216 (Advanced Materials Research; Vol. 264-265).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Saud, N & Jalar @ Jalil, A 2011, Sn-rich phase coarsening in Sn-Ag-Cu solder joint during moderate current stressing. in Advanced Materials Research. vol. 264-265, Advanced Materials Research, vol. 264-265, pp. 212-216, International Conference on Advances in Materials and Processing Technologies, AMPT 2009, 26/10/09. https://doi.org/10.4028/www.scientific.net/AMR.264-265.212
Saud, N. ; Jalar @ Jalil, Azman. / Sn-rich phase coarsening in Sn-Ag-Cu solder joint during moderate current stressing. Advanced Materials Research. Vol. 264-265 2011. pp. 212-216 (Advanced Materials Research).
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