Sn-rich phase coarsening during isothermal annealing on Sn-Ag-Cu solder

Research output: Contribution to journalArticle

Abstract

The microstructure study of eutectic Sn-3.8Ag-0.7Cu (SAC) during isothermal aging has been investigated. Isothermal aging temperature were 30°C, 60°C, 90°C, 120°C, 150°C and 180°C for 216 hours of aging time. Infinite Focus Microscope (IFM) is used for microscopy analysis. The influence of microstructure changes is established. Results showed that Sn-rich phases and eutectic phases appear immediately after reflow. However, the diffusion of eutectic component into Sn-rich phases has altered the microstructure of the SAC solder, as will be discussed further. The calculated activation energy value for Sn-rich phase coarsening is 76kJ/mol, which represent the volume diffusion mechanism.

Original languageEnglish
Pages (from-to)147-151
Number of pages5
JournalInternational Journal of Mechanical and Materials Engineering
Volume4
Issue number2
Publication statusPublished - 2009

Fingerprint

Isothermal annealing
Coarsening
Soldering alloys
Eutectics
Aging of materials
Microstructure
Microscopic examination
Microscopes
Activation energy
Temperature

Keywords

  • Annealing
  • Diffusion
  • Sn-Ag-cu
  • Sn-rich phase

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Materials Science(all)

Cite this

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title = "Sn-rich phase coarsening during isothermal annealing on Sn-Ag-Cu solder",
abstract = "The microstructure study of eutectic Sn-3.8Ag-0.7Cu (SAC) during isothermal aging has been investigated. Isothermal aging temperature were 30°C, 60°C, 90°C, 120°C, 150°C and 180°C for 216 hours of aging time. Infinite Focus Microscope (IFM) is used for microscopy analysis. The influence of microstructure changes is established. Results showed that Sn-rich phases and eutectic phases appear immediately after reflow. However, the diffusion of eutectic component into Sn-rich phases has altered the microstructure of the SAC solder, as will be discussed further. The calculated activation energy value for Sn-rich phase coarsening is 76kJ/mol, which represent the volume diffusion mechanism.",
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author = "N. Saud and {Jalar @ Jalil}, Azman",
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journal = "International Journal of Mechanical and Materials Engineering",
issn = "1823-0334",
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T1 - Sn-rich phase coarsening during isothermal annealing on Sn-Ag-Cu solder

AU - Saud, N.

AU - Jalar @ Jalil, Azman

PY - 2009

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N2 - The microstructure study of eutectic Sn-3.8Ag-0.7Cu (SAC) during isothermal aging has been investigated. Isothermal aging temperature were 30°C, 60°C, 90°C, 120°C, 150°C and 180°C for 216 hours of aging time. Infinite Focus Microscope (IFM) is used for microscopy analysis. The influence of microstructure changes is established. Results showed that Sn-rich phases and eutectic phases appear immediately after reflow. However, the diffusion of eutectic component into Sn-rich phases has altered the microstructure of the SAC solder, as will be discussed further. The calculated activation energy value for Sn-rich phase coarsening is 76kJ/mol, which represent the volume diffusion mechanism.

AB - The microstructure study of eutectic Sn-3.8Ag-0.7Cu (SAC) during isothermal aging has been investigated. Isothermal aging temperature were 30°C, 60°C, 90°C, 120°C, 150°C and 180°C for 216 hours of aging time. Infinite Focus Microscope (IFM) is used for microscopy analysis. The influence of microstructure changes is established. Results showed that Sn-rich phases and eutectic phases appear immediately after reflow. However, the diffusion of eutectic component into Sn-rich phases has altered the microstructure of the SAC solder, as will be discussed further. The calculated activation energy value for Sn-rich phase coarsening is 76kJ/mol, which represent the volume diffusion mechanism.

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