Sn-rich phase coarsening during isothermal annealing for as-soldered Sn-Ag-Cu solder

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The effect of Sn-rich coarsening in Sn-Ag-Cu solder joints produced by isothermal annealing was investigated. The isothermal annealing temperatures employed were from 30 to 150 °C for 24 h up to 1,008 h of annealing time. An Infinite Focus Measurement system (IFM®) and Scanning Electron Microscopy-Energy Dispersive Spectroscopy (SEM-EDS) were used for microscopic analysis and elemental analysis, respectively. As the annealing time and temperature increased, a eutectic component Cu, diffused into the Sn-rich phases, coarsening the Sn-rich phases, and the activation energy value for the coarsening was determined to be 41 kJ/mol.

Original languageEnglish
Pages (from-to)1083-1089
Number of pages7
JournalJournal of Materials Science: Materials in Electronics
Volume21
Issue number10
DOIs
Publication statusPublished - Oct 2010

Fingerprint

Isothermal annealing
Coarsening
solders
Soldering alloys
annealing
Annealing
Eutectics
Energy dispersive spectroscopy
Activation energy
eutectics
Temperature
Scanning electron microscopy
activation energy
Chemical analysis
scanning electron microscopy
temperature
spectroscopy
energy

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Atomic and Molecular Physics, and Optics
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Sn-rich phase coarsening during isothermal annealing for as-soldered Sn-Ag-Cu solder. / Saud, N.; Jalar @ Jalil, Azman.

In: Journal of Materials Science: Materials in Electronics, Vol. 21, No. 10, 10.2010, p. 1083-1089.

Research output: Contribution to journalArticle

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