Sintered silver (Ag) as lead-free die attach materials

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper documents the feasibility study of using micrometer-scale Ag paste as a lead-free (Pb-free) die attach material for microelectronic packaging. Currently, there is no viable Pb-free die attach in the market which can pass the reliability testing regimen. Sintered Ag was explored as an interconnect material because of its relatively low processing temperature and robust joint after sintered. This report suggests a possible route for using Ag paste as a Pb-free die attach by dispensing as per current production epoxy die attach. This feasibility study reports the mechanical integrity, electrical and reliability testing of a surface mount power package with four types of dispensable Ag pastes. Separate lots of this surface-mount power package with current die attach materials were also evaluated as controls. This paper is expected to be of interest to companies that are exploring alternative Pb-free die attach materials.

Original languageEnglish
Title of host publicationProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2012 - Ipoh, Perak
Duration: 6 Nov 20128 Nov 2012

Other

Other2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2012
CityIpoh, Perak
Period6/11/128/11/12

Fingerprint

Silver
Lead
Testing
Microelectronics
Packaging
Processing
Industry
Temperature

Keywords

  • Pb-free die attach
  • sintered Ag joint

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Siow, K. S. (2012). Sintered silver (Ag) as lead-free die attach materials. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium [6521795] https://doi.org/10.1109/IEMT.2012.6521795

Sintered silver (Ag) as lead-free die attach materials. / Siow, Kim Shyong.

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2012. 6521795.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Siow, KS 2012, Sintered silver (Ag) as lead-free die attach materials. in Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium., 6521795, 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2012, Ipoh, Perak, 6/11/12. https://doi.org/10.1109/IEMT.2012.6521795
Siow KS. Sintered silver (Ag) as lead-free die attach materials. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2012. 6521795 https://doi.org/10.1109/IEMT.2012.6521795
Siow, Kim Shyong. / Sintered silver (Ag) as lead-free die attach materials. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2012.
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