Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching

Rosminazuin Ab Rahim, Badariah Bais, Burhanuddin Yeop Majlis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, a simple microcantilever release process using anisotropic wet etching is presented. The microcantilever release is conducted at the final stage of the fabrication of piezoresistive microcantilever sensor. Issues related to microcantilever release such as microscopic roughness and macroscopic roughness has been resolved using simple technique. By utilizing silicon oxide (SiO2) as the etch stop for the wet etching process, issues related to microscopic roughness can be eliminated. On the other hand, proper etching procedure with constant stirring of the etchant solution of KOH anisotropic etching significantly reduces the notching effect contributed by the macroscopic roughness. Upon the completion of microcantilever release, suspended microcantilever of 2μm thick is realized with the removal of SiO2 layer using Buffered Oxide Etching (BOE).

Original languageEnglish
Title of host publicationApplied Mechanics and Materials
PublisherTrans Tech Publications Ltd
Pages894-898
Number of pages5
Volume660
ISBN (Print)9783038352785, 9783038352785
DOIs
Publication statusPublished - 2014
Event5th International Conference on Mechanical and Manufacturing Engineering 2014, ICME 2014 - Bandung
Duration: 29 Oct 201430 Oct 2014

Publication series

NameApplied Mechanics and Materials
Volume660
ISSN (Print)16609336
ISSN (Electronic)16627482

Other

Other5th International Conference on Mechanical and Manufacturing Engineering 2014, ICME 2014
CityBandung
Period29/10/1430/10/14

Fingerprint

Wet etching
Surface roughness
Anisotropic etching
Silicon
Sensors
Etching
Silicon oxides
Fabrication
Oxides

Keywords

  • Biosensor
  • Cantilever
  • MEMS
  • Piezoresistor

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Rahim, R. A., Bais, B., & Yeop Majlis, B. (2014). Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching. In Applied Mechanics and Materials (Vol. 660, pp. 894-898). (Applied Mechanics and Materials; Vol. 660). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/AMM.660.894

Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching. / Rahim, Rosminazuin Ab; Bais, Badariah; Yeop Majlis, Burhanuddin.

Applied Mechanics and Materials. Vol. 660 Trans Tech Publications Ltd, 2014. p. 894-898 (Applied Mechanics and Materials; Vol. 660).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rahim, RA, Bais, B & Yeop Majlis, B 2014, Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching. in Applied Mechanics and Materials. vol. 660, Applied Mechanics and Materials, vol. 660, Trans Tech Publications Ltd, pp. 894-898, 5th International Conference on Mechanical and Manufacturing Engineering 2014, ICME 2014, Bandung, 29/10/14. https://doi.org/10.4028/www.scientific.net/AMM.660.894
Rahim RA, Bais B, Yeop Majlis B. Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching. In Applied Mechanics and Materials. Vol. 660. Trans Tech Publications Ltd. 2014. p. 894-898. (Applied Mechanics and Materials). https://doi.org/10.4028/www.scientific.net/AMM.660.894
Rahim, Rosminazuin Ab ; Bais, Badariah ; Yeop Majlis, Burhanuddin. / Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching. Applied Mechanics and Materials. Vol. 660 Trans Tech Publications Ltd, 2014. pp. 894-898 (Applied Mechanics and Materials).
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