Si monolithic planar coreless inductors for high frequency signal transmission

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we present a silicon based planar coupled inductor coil that operates at high frequency region for signal transmission and converter applications. The study is aimed to investigate the role of coreless planar inductor coil design and MEMS technology for the fabrication of the high frequency signal converter. As the result, it is shown that the coupled inductor performances are significantly affected by the coil winding and geometry. An output voltage gain of -3 dB was observed for a coil operating frequency up to 10 MHz. Topics such as lumped element model and surface micromachining process are described in detail in this paper.

Original languageEnglish
Title of host publicationRFM 2013 - 2013 IEEE International RF and Microwave Conference, Proceedings
PublisherIEEE Computer Society
Pages47-50
Number of pages4
DOIs
Publication statusPublished - 2013
Event2013 5th IEEE International RF and Microwave Conference, RFM 2013 - Penang
Duration: 9 Dec 201311 Dec 2013

Other

Other2013 5th IEEE International RF and Microwave Conference, RFM 2013
CityPenang
Period9/12/1311/12/13

Fingerprint

Surface micromachining
MEMS
Fabrication
Silicon
Geometry
Electric potential

Keywords

  • design
  • high frequency power converter
  • measurement
  • MEMS fabrication
  • Planar coreless inductor

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Yunas, J., Yeop Majlis, B., Hamzah, A. A., & Bais, B. (2013). Si monolithic planar coreless inductors for high frequency signal transmission. In RFM 2013 - 2013 IEEE International RF and Microwave Conference, Proceedings (pp. 47-50). [6757215] IEEE Computer Society. https://doi.org/10.1109/RFM.2013.6757215

Si monolithic planar coreless inductors for high frequency signal transmission. / Yunas, Jumril; Yeop Majlis, Burhanuddin; Hamzah, Azrul Azlan; Bais, Badariah.

RFM 2013 - 2013 IEEE International RF and Microwave Conference, Proceedings. IEEE Computer Society, 2013. p. 47-50 6757215.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yunas, J, Yeop Majlis, B, Hamzah, AA & Bais, B 2013, Si monolithic planar coreless inductors for high frequency signal transmission. in RFM 2013 - 2013 IEEE International RF and Microwave Conference, Proceedings., 6757215, IEEE Computer Society, pp. 47-50, 2013 5th IEEE International RF and Microwave Conference, RFM 2013, Penang, 9/12/13. https://doi.org/10.1109/RFM.2013.6757215
Yunas J, Yeop Majlis B, Hamzah AA, Bais B. Si monolithic planar coreless inductors for high frequency signal transmission. In RFM 2013 - 2013 IEEE International RF and Microwave Conference, Proceedings. IEEE Computer Society. 2013. p. 47-50. 6757215 https://doi.org/10.1109/RFM.2013.6757215
Yunas, Jumril ; Yeop Majlis, Burhanuddin ; Hamzah, Azrul Azlan ; Bais, Badariah. / Si monolithic planar coreless inductors for high frequency signal transmission. RFM 2013 - 2013 IEEE International RF and Microwave Conference, Proceedings. IEEE Computer Society, 2013. pp. 47-50
@inproceedings{ea69e18cf4d942708c1cced689e3e747,
title = "Si monolithic planar coreless inductors for high frequency signal transmission",
abstract = "In this paper, we present a silicon based planar coupled inductor coil that operates at high frequency region for signal transmission and converter applications. The study is aimed to investigate the role of coreless planar inductor coil design and MEMS technology for the fabrication of the high frequency signal converter. As the result, it is shown that the coupled inductor performances are significantly affected by the coil winding and geometry. An output voltage gain of -3 dB was observed for a coil operating frequency up to 10 MHz. Topics such as lumped element model and surface micromachining process are described in detail in this paper.",
keywords = "design, high frequency power converter, measurement, MEMS fabrication, Planar coreless inductor",
author = "Jumril Yunas and {Yeop Majlis}, Burhanuddin and Hamzah, {Azrul Azlan} and Badariah Bais",
year = "2013",
doi = "10.1109/RFM.2013.6757215",
language = "English",
pages = "47--50",
booktitle = "RFM 2013 - 2013 IEEE International RF and Microwave Conference, Proceedings",
publisher = "IEEE Computer Society",

}

TY - GEN

T1 - Si monolithic planar coreless inductors for high frequency signal transmission

AU - Yunas, Jumril

AU - Yeop Majlis, Burhanuddin

AU - Hamzah, Azrul Azlan

AU - Bais, Badariah

PY - 2013

Y1 - 2013

N2 - In this paper, we present a silicon based planar coupled inductor coil that operates at high frequency region for signal transmission and converter applications. The study is aimed to investigate the role of coreless planar inductor coil design and MEMS technology for the fabrication of the high frequency signal converter. As the result, it is shown that the coupled inductor performances are significantly affected by the coil winding and geometry. An output voltage gain of -3 dB was observed for a coil operating frequency up to 10 MHz. Topics such as lumped element model and surface micromachining process are described in detail in this paper.

AB - In this paper, we present a silicon based planar coupled inductor coil that operates at high frequency region for signal transmission and converter applications. The study is aimed to investigate the role of coreless planar inductor coil design and MEMS technology for the fabrication of the high frequency signal converter. As the result, it is shown that the coupled inductor performances are significantly affected by the coil winding and geometry. An output voltage gain of -3 dB was observed for a coil operating frequency up to 10 MHz. Topics such as lumped element model and surface micromachining process are described in detail in this paper.

KW - design

KW - high frequency power converter

KW - measurement

KW - MEMS fabrication

KW - Planar coreless inductor

UR - http://www.scopus.com/inward/record.url?scp=84898023691&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84898023691&partnerID=8YFLogxK

U2 - 10.1109/RFM.2013.6757215

DO - 10.1109/RFM.2013.6757215

M3 - Conference contribution

SP - 47

EP - 50

BT - RFM 2013 - 2013 IEEE International RF and Microwave Conference, Proceedings

PB - IEEE Computer Society

ER -