Shock Wave Effect on Micromechanics Properties of Sn-Ag-Cu solder (SAC 387) via Nanoindentation

Nur Shafiqa Safee, Wan Yusmawati Wan Yusoff, Ariffin Ismail, Norliza Ismail, Emee Marina Salleh, Maria Abu Bakar, Azman Jalar @ Jalil

Research output: Contribution to journalConference article

Abstract

A variety of Sn-Ag-Cu solder alloys have been proposed and recommended for use in industrial organizations for example Sn-95.5Ag3.8Cu-0.7 (SAC 387) by the European Consortium Brite-Euram in the European Union. In this study an effect of shock wave on micromechanics properties of SAC 387 solder was investigated via nanoindentation approach. Solder joint of SAC 387 on copper substrate was prepared by hand soldering techniques. Then soldered samples were exposed to shock wave at different distance of 1 m, 2 m and 3 m. The shock wave test was conducted using 500 g of trinitrotoluene (TNT). Hardness value of SAC 387 decreased from 300 MPa to 130 MPa as well as reduced modulus drop from 115 GPa to 43 GPa after exposure. However the hardness and reduced modulus increased with increasing distance of the shock wave. The phenomenon revealed that shock wave deteriorated the micromechanics properties of soldered samples.

Original languageEnglish
Article number012013
JournalIOP Conference Series: Materials Science and Engineering
Volume409
Issue number1
DOIs
Publication statusPublished - 6 Nov 2018
Event2018 3rd International Conference on Mining, Materials and Metallurgical Engineering, ICMMME 2018 - Kuala Lumpur, Malaysia
Duration: 17 Mar 201819 Mar 2018

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Wave effects
Micromechanics
Nanoindentation
Shock waves
Soldering alloys
Hardness
Trinitrotoluene
Soldering
Copper
Substrates

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)

Cite this

Shock Wave Effect on Micromechanics Properties of Sn-Ag-Cu solder (SAC 387) via Nanoindentation. / Safee, Nur Shafiqa; Yusoff, Wan Yusmawati Wan; Ismail, Ariffin; Ismail, Norliza; Salleh, Emee Marina; Bakar, Maria Abu; Jalar @ Jalil, Azman.

In: IOP Conference Series: Materials Science and Engineering, Vol. 409, No. 1, 012013, 06.11.2018.

Research output: Contribution to journalConference article

Safee, Nur Shafiqa ; Yusoff, Wan Yusmawati Wan ; Ismail, Ariffin ; Ismail, Norliza ; Salleh, Emee Marina ; Bakar, Maria Abu ; Jalar @ Jalil, Azman. / Shock Wave Effect on Micromechanics Properties of Sn-Ag-Cu solder (SAC 387) via Nanoindentation. In: IOP Conference Series: Materials Science and Engineering. 2018 ; Vol. 409, No. 1.
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AU - Ismail, Norliza

AU - Salleh, Emee Marina

AU - Bakar, Maria Abu

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