Semiconductor final test fixture design with microstructure alloy contacts using finite element analysis

Z. Y. Lam, H. W. Koay, Nowshad Amin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In this paper, a novel electrical contact mechanism that serves as a low insertion-force test socket is investigated by Finite Element Analysis. The proposed electrical contact mechanism is made up of three different materials such as polymer, metallic alloy and liquid metal. Due to the uneven stress distribution of the conventional pogo pin systems, large puncture marks occur on the integrated circuit contacts. The proposed design enhances the overall stress distribution performance of the electrical contact with integrated circuit as found from the analysis. Parameters such as the number of microstructure contacts and the pitch size among them give influential impact on the overall stress distribution performance. Generally, the more the microstructure contact, the more the stress distribution gets evenness. However, the stress distribution becomes saturated when the number of microstructure contacts reaches 16 for a total area of 0.25 mm x 0.25 mm. The pitch size of 0.07 mm gives the best performance for the given total contact area. Any pitch above will set the microstructure contacts to the edges of the contact area, which decreases the stress distribution performance. A factor of safety analysis is performed for the proposed design and a value of 4.9 is achieved, which is almost 5 times greater than the minimum requirement of 1.0.

Original languageEnglish
Title of host publicationProceedings of the Electronic Packaging Technology Conference, EPTC
Pages834-837
Number of pages4
DOIs
Publication statusPublished - 2009
Event2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore
Duration: 9 Dec 200911 Dec 2009

Other

Other2009 11th Electronic Packaging Technology Conference, EPTC 2009
CitySingapore
Period9/12/0911/12/09

Fingerprint

fixtures
stress distribution
Stress concentration
Semiconductor materials
Finite element method
microstructure
Microstructure
electric contacts
integrated circuits
Integrated circuits
liquid metals
Liquid metals
insertion
safety
Polymers
requirements
polymers
metals

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Lam, Z. Y., Koay, H. W., & Amin, N. (2009). Semiconductor final test fixture design with microstructure alloy contacts using finite element analysis. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 834-837). [5416435] https://doi.org/10.1109/EPTC.2009.5416435

Semiconductor final test fixture design with microstructure alloy contacts using finite element analysis. / Lam, Z. Y.; Koay, H. W.; Amin, Nowshad.

Proceedings of the Electronic Packaging Technology Conference, EPTC. 2009. p. 834-837 5416435.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lam, ZY, Koay, HW & Amin, N 2009, Semiconductor final test fixture design with microstructure alloy contacts using finite element analysis. in Proceedings of the Electronic Packaging Technology Conference, EPTC., 5416435, pp. 834-837, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, 9/12/09. https://doi.org/10.1109/EPTC.2009.5416435
Lam ZY, Koay HW, Amin N. Semiconductor final test fixture design with microstructure alloy contacts using finite element analysis. In Proceedings of the Electronic Packaging Technology Conference, EPTC. 2009. p. 834-837. 5416435 https://doi.org/10.1109/EPTC.2009.5416435
Lam, Z. Y. ; Koay, H. W. ; Amin, Nowshad. / Semiconductor final test fixture design with microstructure alloy contacts using finite element analysis. Proceedings of the Electronic Packaging Technology Conference, EPTC. 2009. pp. 834-837
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