Self-aligned Cu electroplating of the front surface contact on silicon solar cells

S. N Sharifah Nurain, Saleem H. Zaidi, M. Y. Sulaiman, Kamaruzzaman Sopian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Industrially-manufactured crystalline silicon (Si) solar cell contacts are based on screen printing of metal pastes silver (Ag) on the front and aluminum (Al) on the back surface, respectively. Screen printed contacts are inherently inefficient and requires high processing temperatures. Alternate metal contacts for silicon solar cells based on electroplating have been investigated. Metallization schemes based on electroless nickel (Ni) and copper (Cu) electroplating offers a simple, costeffective, low processing temperature and reduced contact resistivity option for silicon solar cells. An ohmic contact to ndoped emitter is formed with an electroless Ni deposition process using self-aligned approach. This allows Cu electroplating only on the Ni seed layer, which eliminates the need of additional processing for protecting active device regions. This metallization scheme exhibited higher performance with higher fill factors and open-circuit voltages in contrast with screen-printed solar cells.

Original languageEnglish
Title of host publicationAIP Conference Proceedings
Pages230-241
Number of pages12
Volume1502
Edition1
DOIs
Publication statusPublished - 2012
EventInternational Conference on Nanotechnology - Research and Commercialization 2011, ICONT 2011 - Sabah
Duration: 6 Jun 20119 Jun 2011

Other

OtherInternational Conference on Nanotechnology - Research and Commercialization 2011, ICONT 2011
CitySabah
Period6/6/119/6/11

Fingerprint

electroplating
solar cells
electric contacts
nickel
open circuit voltage
printing
metals
seeds
emitters
silver
aluminum
copper
electrical resistivity
temperature

Keywords

  • Contacts
  • Copper
  • Electroless Nickel
  • Electroplating
  • Solar cells

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Nurain, S. N. S., Zaidi, S. H., Sulaiman, M. Y., & Sopian, K. (2012). Self-aligned Cu electroplating of the front surface contact on silicon solar cells. In AIP Conference Proceedings (1 ed., Vol. 1502, pp. 230-241) https://doi.org/10.1063/1.4769147

Self-aligned Cu electroplating of the front surface contact on silicon solar cells. / Nurain, S. N Sharifah; Zaidi, Saleem H.; Sulaiman, M. Y.; Sopian, Kamaruzzaman.

AIP Conference Proceedings. Vol. 1502 1. ed. 2012. p. 230-241.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nurain, SNS, Zaidi, SH, Sulaiman, MY & Sopian, K 2012, Self-aligned Cu electroplating of the front surface contact on silicon solar cells. in AIP Conference Proceedings. 1 edn, vol. 1502, pp. 230-241, International Conference on Nanotechnology - Research and Commercialization 2011, ICONT 2011, Sabah, 6/6/11. https://doi.org/10.1063/1.4769147
Nurain SNS, Zaidi SH, Sulaiman MY, Sopian K. Self-aligned Cu electroplating of the front surface contact on silicon solar cells. In AIP Conference Proceedings. 1 ed. Vol. 1502. 2012. p. 230-241 https://doi.org/10.1063/1.4769147
Nurain, S. N Sharifah ; Zaidi, Saleem H. ; Sulaiman, M. Y. ; Sopian, Kamaruzzaman. / Self-aligned Cu electroplating of the front surface contact on silicon solar cells. AIP Conference Proceedings. Vol. 1502 1. ed. 2012. pp. 230-241
@inproceedings{a03185155b614764b8f8e770425665e8,
title = "Self-aligned Cu electroplating of the front surface contact on silicon solar cells",
abstract = "Industrially-manufactured crystalline silicon (Si) solar cell contacts are based on screen printing of metal pastes silver (Ag) on the front and aluminum (Al) on the back surface, respectively. Screen printed contacts are inherently inefficient and requires high processing temperatures. Alternate metal contacts for silicon solar cells based on electroplating have been investigated. Metallization schemes based on electroless nickel (Ni) and copper (Cu) electroplating offers a simple, costeffective, low processing temperature and reduced contact resistivity option for silicon solar cells. An ohmic contact to ndoped emitter is formed with an electroless Ni deposition process using self-aligned approach. This allows Cu electroplating only on the Ni seed layer, which eliminates the need of additional processing for protecting active device regions. This metallization scheme exhibited higher performance with higher fill factors and open-circuit voltages in contrast with screen-printed solar cells.",
keywords = "Contacts, Copper, Electroless Nickel, Electroplating, Solar cells",
author = "Nurain, {S. N Sharifah} and Zaidi, {Saleem H.} and Sulaiman, {M. Y.} and Kamaruzzaman Sopian",
year = "2012",
doi = "10.1063/1.4769147",
language = "English",
isbn = "9780735411197",
volume = "1502",
pages = "230--241",
booktitle = "AIP Conference Proceedings",
edition = "1",

}

TY - GEN

T1 - Self-aligned Cu electroplating of the front surface contact on silicon solar cells

AU - Nurain, S. N Sharifah

AU - Zaidi, Saleem H.

AU - Sulaiman, M. Y.

AU - Sopian, Kamaruzzaman

PY - 2012

Y1 - 2012

N2 - Industrially-manufactured crystalline silicon (Si) solar cell contacts are based on screen printing of metal pastes silver (Ag) on the front and aluminum (Al) on the back surface, respectively. Screen printed contacts are inherently inefficient and requires high processing temperatures. Alternate metal contacts for silicon solar cells based on electroplating have been investigated. Metallization schemes based on electroless nickel (Ni) and copper (Cu) electroplating offers a simple, costeffective, low processing temperature and reduced contact resistivity option for silicon solar cells. An ohmic contact to ndoped emitter is formed with an electroless Ni deposition process using self-aligned approach. This allows Cu electroplating only on the Ni seed layer, which eliminates the need of additional processing for protecting active device regions. This metallization scheme exhibited higher performance with higher fill factors and open-circuit voltages in contrast with screen-printed solar cells.

AB - Industrially-manufactured crystalline silicon (Si) solar cell contacts are based on screen printing of metal pastes silver (Ag) on the front and aluminum (Al) on the back surface, respectively. Screen printed contacts are inherently inefficient and requires high processing temperatures. Alternate metal contacts for silicon solar cells based on electroplating have been investigated. Metallization schemes based on electroless nickel (Ni) and copper (Cu) electroplating offers a simple, costeffective, low processing temperature and reduced contact resistivity option for silicon solar cells. An ohmic contact to ndoped emitter is formed with an electroless Ni deposition process using self-aligned approach. This allows Cu electroplating only on the Ni seed layer, which eliminates the need of additional processing for protecting active device regions. This metallization scheme exhibited higher performance with higher fill factors and open-circuit voltages in contrast with screen-printed solar cells.

KW - Contacts

KW - Copper

KW - Electroless Nickel

KW - Electroplating

KW - Solar cells

UR - http://www.scopus.com/inward/record.url?scp=84874481156&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84874481156&partnerID=8YFLogxK

U2 - 10.1063/1.4769147

DO - 10.1063/1.4769147

M3 - Conference contribution

AN - SCOPUS:84874481156

SN - 9780735411197

VL - 1502

SP - 230

EP - 241

BT - AIP Conference Proceedings

ER -