Saw singulation characterization on high profile multi chip module packages with thick leadframe

Nazrul Anuar Nayan, Amalina Taib

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Increasing demand for Multi Chip Module (MCM) Power devices in a Quad Flat Non-leaded (QFN) package outline drives the development of the LFCSPs-P (Lead Frame Chip Scale Package-saw-Power). Multi Chip Module offers host benefit including performance improvements such as shorter interconnect lengths between dies, lower power supply inductance and lower off-chip driver. Besides, it can reduce the manufacturing cost and increase the utility of programmable systems [1]. Compared to the leaded package with similar body sizes and lead counts, QFN offers far superior thermal performance and provides excellent electrical characteristics [2]. Package designers used nominal thickness of standard Cu-Alloy leadframe and standard package height meant for power packages with soft solder die attach and heavy Al wire bonding to enhance heat dissipation capability other than the heat sinks. Map type design is used to enhance productivity by maximizing the device density. Singulation is achieved by sawing through the molded leadframe channels with diamond type blades that separated the arrays rows and columns [2]. However, the combination of ductile and brittle material in the same sawing process creates real challenges in term of sawing quality, blade life and throughput. Experiments were carried out and its results show that integration of the blade type, parameters, methodology and other external features give the maximum result for the said challenges

Original languageEnglish
Title of host publicationProceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
EditorsK.C. Toh, Y.C. Mui, J. How, J.H.L. Pang
Pages298-302
Number of pages5
Publication statusPublished - 2004
Externally publishedYes
Event6th Electronics Packaging Technology Conference, EPTC 2004 - Singapore
Duration: 8 Dec 200510 Dec 2005

Other

Other6th Electronics Packaging Technology Conference, EPTC 2004
CitySingapore
Period8/12/0510/12/05

Fingerprint

Sawing
Metal working saws
Chip scale packages
Heat sinks
Brittleness
Heat losses
Inductance
Soldering alloys
Diamonds
Lead
Productivity
Throughput
Wire
Costs
Experiments

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Nayan, N. A., & Taib, A. (2004). Saw singulation characterization on high profile multi chip module packages with thick leadframe. In K. C. Toh, Y. C. Mui, J. How, & J. H. L. Pang (Eds.), Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 (pp. 298-302). [C3.4]

Saw singulation characterization on high profile multi chip module packages with thick leadframe. / Nayan, Nazrul Anuar; Taib, Amalina.

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004. ed. / K.C. Toh; Y.C. Mui; J. How; J.H.L. Pang. 2004. p. 298-302 C3.4.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nayan, NA & Taib, A 2004, Saw singulation characterization on high profile multi chip module packages with thick leadframe. in KC Toh, YC Mui, J How & JHL Pang (eds), Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004., C3.4, pp. 298-302, 6th Electronics Packaging Technology Conference, EPTC 2004, Singapore, 8/12/05.
Nayan NA, Taib A. Saw singulation characterization on high profile multi chip module packages with thick leadframe. In Toh KC, Mui YC, How J, Pang JHL, editors, Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004. 2004. p. 298-302. C3.4
Nayan, Nazrul Anuar ; Taib, Amalina. / Saw singulation characterization on high profile multi chip module packages with thick leadframe. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004. editor / K.C. Toh ; Y.C. Mui ; J. How ; J.H.L. Pang. 2004. pp. 298-302
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