SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

Fakhrozi Che Ani, Azman Jalar @ Jalil, Abdullah Aziz Saad, Chu Yee Khor, Roslina Ismail, Zuraihana Bachok, Mohamad Aizat Abas, Norinsan Kamil Othman

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

Purpose - This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach - This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings - The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications - This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value - The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.

Original languageEnglish
Pages (from-to)1-13
Number of pages13
JournalSoldering and Surface Mount Technology
Volume30
Issue number1
DOIs
Publication statusPublished - 1 Jan 2018

Fingerprint

solders
Soldering alloys
assembly
fillets
Ointments
Microstructure
Energy dispersive spectroscopy
Capacitors
Electron microscopes
Nanoparticles
X ray spectrometers
microstructure
capacitors
Focused ion beams
Soldering
electron microscopes
Microelectronics
Printed circuit boards
Field emission
Intermetallics

Keywords

  • Nano-reinforced lead free solder
  • SAC305
  • Titanium dioxide nanoparticle
  • Ultra-fine package

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly. / Ani, Fakhrozi Che; Jalar @ Jalil, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Ismail, Roslina; Bachok, Zuraihana; Abas, Mohamad Aizat; Othman, Norinsan Kamil.

In: Soldering and Surface Mount Technology, Vol. 30, No. 1, 01.01.2018, p. 1-13.

Research output: Contribution to journalArticle

Ani, Fakhrozi Che ; Jalar @ Jalil, Azman ; Saad, Abdullah Aziz ; Khor, Chu Yee ; Ismail, Roslina ; Bachok, Zuraihana ; Abas, Mohamad Aizat ; Othman, Norinsan Kamil. / SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly. In: Soldering and Surface Mount Technology. 2018 ; Vol. 30, No. 1. pp. 1-13.
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