Abstract
Purpose – This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach – This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings – The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications – This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value – The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.
| Original language | English |
|---|---|
| Journal | Soldering and Surface Mount Technology |
| DOIs | |
| Publication status | Accepted/In press - 7 Jan 2018 |
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Keywords
- Nano-reinforced lead free solder
- SAC305
- Titanium dioxide nanoparticle
- Ultra-fine package
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Electrical and Electronic Engineering
Cite this
SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly. / Che Ani, Fakhrozi; Jalar @ Jalil, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Ismail, Roslina; Bachok, Zuraihana; Abas, Mohamad Aizat; Othman, Norinsan Kamil.
In: Soldering and Surface Mount Technology, 07.01.2018.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
AU - Che Ani, Fakhrozi
AU - Jalar @ Jalil, Azman
AU - Saad, Abdullah Aziz
AU - Khor, Chu Yee
AU - Ismail, Roslina
AU - Bachok, Zuraihana
AU - Abas, Mohamad Aizat
AU - Othman, Norinsan Kamil
PY - 2018/1/7
Y1 - 2018/1/7
N2 - Purpose – This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach – This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings – The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications – This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value – The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.
AB - Purpose – This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach – This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings – The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications – This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value – The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.
KW - Nano-reinforced lead free solder
KW - SAC305
KW - Titanium dioxide nanoparticle
KW - Ultra-fine package
UR - http://www.scopus.com/inward/record.url?scp=85040109706&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85040109706&partnerID=8YFLogxK
U2 - 10.1108/SSMT-04-2017-0011
DO - 10.1108/SSMT-04-2017-0011
M3 - Article
AN - SCOPUS:85040109706
JO - Soldering and Surface Mount Technology
JF - Soldering and Surface Mount Technology
SN - 0954-0911
ER -