SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

Fakhrozi Che Ani, Azman Jalar @ Jalil, Abdullah Aziz Saad, Chu Yee Khor, Roslina Ismail, Zuraihana Bachok, Mohamad Aizat Abas, Norinsan Kamil Othman

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Purpose – This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach – This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings – The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications – This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value – The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.

Original languageEnglish
JournalSoldering and Surface Mount Technology
DOIs
Publication statusAccepted/In press - 7 Jan 2018

Fingerprint

solders
Soldering alloys
assembly
fillets
Ointments
Microstructure
Energy dispersive spectroscopy
Capacitors
Electron microscopes
Nanoparticles
X ray spectrometers
microstructure
capacitors
Focused ion beams
Soldering
electron microscopes
Microelectronics
Printed circuit boards
Field emission
Intermetallics

Keywords

  • Nano-reinforced lead free solder
  • SAC305
  • Titanium dioxide nanoparticle
  • Ultra-fine package

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly. / Che Ani, Fakhrozi; Jalar @ Jalil, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Ismail, Roslina; Bachok, Zuraihana; Abas, Mohamad Aizat; Othman, Norinsan Kamil.

In: Soldering and Surface Mount Technology, 07.01.2018.

Research output: Contribution to journalArticle

Che Ani, Fakhrozi ; Jalar @ Jalil, Azman ; Saad, Abdullah Aziz ; Khor, Chu Yee ; Ismail, Roslina ; Bachok, Zuraihana ; Abas, Mohamad Aizat ; Othman, Norinsan Kamil. / SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly. In: Soldering and Surface Mount Technology. 2018.
@article{221cc2f995304b879713496541135dbd,
title = "SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly",
abstract = "Purpose – This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach – This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings – The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.{\%}. Increasing the TiO2 content to 0.15 Wt.{\%} led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications – This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value – The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.",
keywords = "Nano-reinforced lead free solder, SAC305, Titanium dioxide nanoparticle, Ultra-fine package",
author = "{Che Ani}, Fakhrozi and {Jalar @ Jalil}, Azman and Saad, {Abdullah Aziz} and Khor, {Chu Yee} and Roslina Ismail and Zuraihana Bachok and Abas, {Mohamad Aizat} and Othman, {Norinsan Kamil}",
year = "2018",
month = "1",
day = "7",
doi = "10.1108/SSMT-04-2017-0011",
language = "English",
journal = "Soldering and Surface Mount Technology",
issn = "0954-0911",
publisher = "Emerald Group Publishing Ltd.",

}

TY - JOUR

T1 - SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

AU - Che Ani, Fakhrozi

AU - Jalar @ Jalil, Azman

AU - Saad, Abdullah Aziz

AU - Khor, Chu Yee

AU - Ismail, Roslina

AU - Bachok, Zuraihana

AU - Abas, Mohamad Aizat

AU - Othman, Norinsan Kamil

PY - 2018/1/7

Y1 - 2018/1/7

N2 - Purpose – This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach – This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings – The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications – This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value – The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.

AB - Purpose – This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach – This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings – The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications – This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value – The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.

KW - Nano-reinforced lead free solder

KW - SAC305

KW - Titanium dioxide nanoparticle

KW - Ultra-fine package

UR - http://www.scopus.com/inward/record.url?scp=85040109706&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85040109706&partnerID=8YFLogxK

U2 - 10.1108/SSMT-04-2017-0011

DO - 10.1108/SSMT-04-2017-0011

M3 - Article

JO - Soldering and Surface Mount Technology

JF - Soldering and Surface Mount Technology

SN - 0954-0911

ER -