Robust microdevice manufacturing by direct lithography and adhesive-free bonding of off-stoichiometry thiol-ene-epoxy (OSTE+) polymer

A. Vastesson, X. Zhou, N. Sandstrom, F. Saharil, O. Supekar, G. Stemme, W. Van Der Wijngaart, T. Haraldsson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

We here demonstrate, for the first time, the use of direct lithography in off-stoichiometry thiol-ene-epoxy (OSTE+) to fabricate a microdevice. First, the photolithographic property of OSTE+ is shown by using a photomask to create micropillars with an aspect-ratio of 1:10 in a 2 mm thick layer. Secondly, a three-layer OSTE+ microdevice containing in-/outlet holes, channels, and pillars is fabricated by using a combination of direct lithography and adhesive-free dry bonding. The resulting microdevice shows desirable properties, such as leak-free filling and hydrophilic surfaces. This fabrication method enhances the microstructurability of OSTE+ beyond that of conventional soft lithography replica molding of other polymers, such as PDMS.

Original languageEnglish
Title of host publication2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Pages408-411
Number of pages4
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 - Barcelona
Duration: 16 Jun 201320 Jun 2013

Other

Other2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
CityBarcelona
Period16/6/1320/6/13

Fingerprint

Stoichiometry
Lithography
Adhesives
Polymers
Photomasks
Molding
Aspect ratio
Fabrication

Keywords

  • bonding
  • epoxy
  • microdevice fabrication
  • Microfluidics
  • OSTE+
  • photolithography
  • soft lithography
  • thiol
  • thiol-ene

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Vastesson, A., Zhou, X., Sandstrom, N., Saharil, F., Supekar, O., Stemme, G., ... Haraldsson, T. (2013). Robust microdevice manufacturing by direct lithography and adhesive-free bonding of off-stoichiometry thiol-ene-epoxy (OSTE+) polymer. In 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 (pp. 408-411). [6626789] https://doi.org/10.1109/Transducers.2013.6626789

Robust microdevice manufacturing by direct lithography and adhesive-free bonding of off-stoichiometry thiol-ene-epoxy (OSTE+) polymer. / Vastesson, A.; Zhou, X.; Sandstrom, N.; Saharil, F.; Supekar, O.; Stemme, G.; Van Der Wijngaart, W.; Haraldsson, T.

2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013. 2013. p. 408-411 6626789.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vastesson, A, Zhou, X, Sandstrom, N, Saharil, F, Supekar, O, Stemme, G, Van Der Wijngaart, W & Haraldsson, T 2013, Robust microdevice manufacturing by direct lithography and adhesive-free bonding of off-stoichiometry thiol-ene-epoxy (OSTE+) polymer. in 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013., 6626789, pp. 408-411, 2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013, Barcelona, 16/6/13. https://doi.org/10.1109/Transducers.2013.6626789
Vastesson A, Zhou X, Sandstrom N, Saharil F, Supekar O, Stemme G et al. Robust microdevice manufacturing by direct lithography and adhesive-free bonding of off-stoichiometry thiol-ene-epoxy (OSTE+) polymer. In 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013. 2013. p. 408-411. 6626789 https://doi.org/10.1109/Transducers.2013.6626789
Vastesson, A. ; Zhou, X. ; Sandstrom, N. ; Saharil, F. ; Supekar, O. ; Stemme, G. ; Van Der Wijngaart, W. ; Haraldsson, T. / Robust microdevice manufacturing by direct lithography and adhesive-free bonding of off-stoichiometry thiol-ene-epoxy (OSTE+) polymer. 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013. 2013. pp. 408-411
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AU - Saharil, F.

AU - Supekar, O.

AU - Stemme, G.

AU - Van Der Wijngaart, W.

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