Reliability study of solder paste alloy for the improvement of solder joint at surface mount fine-pitch components

Mohd Nizam Ab Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, Jaharah A Ghani, Wan Mohd Faizal Wan Mahmood

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers' high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB). The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP) machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm), and the solder height is the table speed of the SP machine (2.5 mm/s).

Original languageEnglish
Pages (from-to)7706-7721
Number of pages16
JournalMaterials
Volume7
Issue number12
DOIs
Publication statusPublished - 2014

Fingerprint

Ointments
Soldering alloys
Printing
Taguchi methods
Electronics industry
Thermal shock
Electric wiring
Printed circuit boards
Tin
Silver
Costs
Copper
Metals

Keywords

  • Dynamic characteristic
  • Fine-pitch component
  • Solder joint
  • Solder paste
  • Taguchi method
  • Thermal shock

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Reliability study of solder paste alloy for the improvement of solder joint at surface mount fine-pitch components. / Ab Rahman, Mohd Nizam; Zubir, Noor Suhana Mohd; Leuveano, Raden Achmad Chairdino; A Ghani, Jaharah; Wan Mahmood, Wan Mohd Faizal.

In: Materials, Vol. 7, No. 12, 2014, p. 7706-7721.

Research output: Contribution to journalArticle

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