Reduction of warpage occurrence on stack-die QFN using FEA and statistical method

I. Abdullah, I. Ahmad, Meor Zainal Meor Talib, M. N B C Kamarudin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Warpage is greatly affected by package geometries, such as dimension of matrix array, pad, die and passive components as well as molding compound properties. It is also related to thermal mismatch i.e. coefficient of thermal expansion (CTE) and reliability of passive components in the package. So in order to reduce warpage occurrence in all packages, it is proposed that the combination of CTE properties of QFN packages layer need to be optimized. This study used finite element method (FEM) to perform extensive structural analysis of QFN package designs with respect to different combination of thermal properties and the possible occurrence of warpage. The results obtained were then verified with experimental data. The FEA method was able to simulate the warpage occurrence and the statistical method was able to identify the optimal combination of thermal properties of the layers. It was also found that the optimum combination of CTE properties will reduce the probability of the warpage occurrence.

Original languageEnglish
Title of host publicationProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
DOIs
Publication statusPublished - 2008
Event2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008 - Penang, Malaysia
Duration: 4 Nov 20086 Nov 2008

Other

Other2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008
CountryMalaysia
CityPenang
Period4/11/086/11/08

Fingerprint

Thermal expansion
Statistical methods
Finite element method
Thermodynamic properties
Sheet molding compounds
Structural analysis
Geometry
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Abdullah, I., Ahmad, I., Meor Talib, M. Z., & Kamarudin, M. N. B. C. (2008). Reduction of warpage occurrence on stack-die QFN using FEA and statistical method. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium [5507788] https://doi.org/10.1109/IEMT.2008.5507788

Reduction of warpage occurrence on stack-die QFN using FEA and statistical method. / Abdullah, I.; Ahmad, I.; Meor Talib, Meor Zainal; Kamarudin, M. N B C.

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008. 5507788.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abdullah, I, Ahmad, I, Meor Talib, MZ & Kamarudin, MNBC 2008, Reduction of warpage occurrence on stack-die QFN using FEA and statistical method. in Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium., 5507788, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008, Penang, Malaysia, 4/11/08. https://doi.org/10.1109/IEMT.2008.5507788
Abdullah I, Ahmad I, Meor Talib MZ, Kamarudin MNBC. Reduction of warpage occurrence on stack-die QFN using FEA and statistical method. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008. 5507788 https://doi.org/10.1109/IEMT.2008.5507788
Abdullah, I. ; Ahmad, I. ; Meor Talib, Meor Zainal ; Kamarudin, M. N B C. / Reduction of warpage occurrence on stack-die QFN using FEA and statistical method. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008.
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