Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging

Yijing Xie, Yanjie Wang, Yunhui Mei, Haining Xie, Kun Zhang, Shuangtao Feng, Kim Shyong Siow, Xin Li, Guo Quan Lu

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

We achieved robust bonding of a large area power chip (>100 mm2) with sintered Ag joint produced by the electrical current assisted sintering (ECAS) technique operating at low current (1.1 kA) and short sintering time (10 s). Our ECAS-ed Ag joint possessed low thermal resistance (∼0.18 °C/W), high density (89.6%), as well as good static and dynamic electrical properties during switching on and off of the power chip. Our TEM analysis explained that the good electrical and thermal performances of the power chip were attributed to the high density of twins formed in the ECAS-ed nano-Ag joint.

Original languageEnglish
Pages (from-to)644-649
Number of pages6
JournalJournal of Materials Processing Technology
Volume255
DOIs
Publication statusPublished - 1 May 2018

Fingerprint

Electronics packaging
Ointments
Sintering
Heat resistance
Electric properties
Transmission electron microscopy

Keywords

  • Current-assisted sintering
  • Die-attach
  • ECAS
  • IGBT
  • Nano-Ag
  • Twin

ASJC Scopus subject areas

  • Ceramics and Composites
  • Computer Science Applications
  • Metals and Alloys
  • Industrial and Manufacturing Engineering

Cite this

Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging. / Xie, Yijing; Wang, Yanjie; Mei, Yunhui; Xie, Haining; Zhang, Kun; Feng, Shuangtao; Siow, Kim Shyong; Li, Xin; Lu, Guo Quan.

In: Journal of Materials Processing Technology, Vol. 255, 01.05.2018, p. 644-649.

Research output: Contribution to journalArticle

Xie, Yijing ; Wang, Yanjie ; Mei, Yunhui ; Xie, Haining ; Zhang, Kun ; Feng, Shuangtao ; Siow, Kim Shyong ; Li, Xin ; Lu, Guo Quan. / Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging. In: Journal of Materials Processing Technology. 2018 ; Vol. 255. pp. 644-649.
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AU - Zhang, Kun

AU - Feng, Shuangtao

AU - Siow, Kim Shyong

AU - Li, Xin

AU - Lu, Guo Quan

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