Rain attenuation model for South East Asia countries

Mandeep Singh Jit Singh, S. I S Hassan, M. F. Ain, F. Ghani, K. Igarashi, K. Tanaka, M. Iida

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

A model for predicting rain attenuation on Earth-to-space is developed by using the measured data obtained from tropical and equatorial regions that was revised from the ITU model. The proposed rain attenuation model uses the complete rainfall rate cumulative distribution as input data. It is shown that significant improvements in terms of prediction error over existing attenuation models are obtained.

Original languageEnglish
Pages (from-to)75-77
Number of pages3
JournalElectronics Letters
Volume43
Issue number2
DOIs
Publication statusPublished - 2007
Externally publishedYes

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Rain
Earth (planet)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Jit Singh, M. S., Hassan, S. I. S., Ain, M. F., Ghani, F., Igarashi, K., Tanaka, K., & Iida, M. (2007). Rain attenuation model for South East Asia countries. Electronics Letters, 43(2), 75-77. https://doi.org/10.1049/el:20072677

Rain attenuation model for South East Asia countries. / Jit Singh, Mandeep Singh; Hassan, S. I S; Ain, M. F.; Ghani, F.; Igarashi, K.; Tanaka, K.; Iida, M.

In: Electronics Letters, Vol. 43, No. 2, 2007, p. 75-77.

Research output: Contribution to journalArticle

Jit Singh, MS, Hassan, SIS, Ain, MF, Ghani, F, Igarashi, K, Tanaka, K & Iida, M 2007, 'Rain attenuation model for South East Asia countries', Electronics Letters, vol. 43, no. 2, pp. 75-77. https://doi.org/10.1049/el:20072677
Jit Singh MS, Hassan SIS, Ain MF, Ghani F, Igarashi K, Tanaka K et al. Rain attenuation model for South East Asia countries. Electronics Letters. 2007;43(2):75-77. https://doi.org/10.1049/el:20072677
Jit Singh, Mandeep Singh ; Hassan, S. I S ; Ain, M. F. ; Ghani, F. ; Igarashi, K. ; Tanaka, K. ; Iida, M. / Rain attenuation model for South East Asia countries. In: Electronics Letters. 2007 ; Vol. 43, No. 2. pp. 75-77.
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